Brewer Science

  • Careers
  • MSDS
  • Environment
  • Site Map
  • 2: Markets
    • 2.1: Semiconductor
    • 2.3: MEMS, Sensors & Displays
      • 2.3.1: Micromachining
      • 2.3.2: Surface Energy Modification
      • 2.3.3: Leveling Extreme Topography
      • 2.3.4: Thin Wafer Handling
      • 2.3.5: MEMS FAQs
    • 2.4: Advanced Packaging
      • 2.4.1: Thin Wafer Handling
        • 2.4.1.1: ZoneBOND™ Process
        • 2.4.1.2: Chemical Debonding
        • 2.4.1.3: Thermal Slide Debonding
      • 2.4.2: Planarization - Trench Fill
      • 2.4.3: Surface Protection
      • 2.4.5: Micromachining
      • 2.4.6: Advanced Packaging FAQs
    • 2.5: LED & Energy
      • 2.5.1: Light Extraction
      • 2.5.2: Wet Etch Protection
      • 2.5.3: Physical Protection
      • 2.5.4: Metal Deposition & Alternatives
      • 2.5.5: Thin Wafer Handling
      • 2.5.6: LED FAQs
    • 2.6: Semiconductor Equipment
  • 4: Products
    • 4.1: Anti-Reflective Coatings
      • 4.1.1: Dry Etch ARC® Coatings
        • 4.1.1.1: 193-nm (ArF) Products
        • 4.1.1.2: 248-nm (KrF) Products
        • 4.1.1.3: 365-nm (i-Line) Products
          • 4.1.1.3.1: ARC i-CON Coating
          • 4.1.1.3.2: XHRiC Coating
          • 4.1.1.3.3: WiDE®-C Coating
          • 4.1.1.3.4: GenARC® 365 Coating
      • 4.1.2: Developer-Soluble BARC
      • 4.1.3: Ancilliary Products
      • 4.1.7: PFOS-Free Program
      • 4.1.8: FAQs
    • 4.2: OptiStack® Systems
      • 4.2.1: OptiStack® Simulation
    • 4.3: Lift-Off Materials
    • 4.4: EUV Assist Layers
    • 4.5: Gap-Fill Systems
    • 4.6: Protective Coatings
      • 4.6.1: Lift-Off Materials
      • 4.6.2: ProTEK® SR Coating
      • 4.6.3: ProTEK® B3 Coatings
      • 4.6.4: ProTEK® PSB Coating
      • 4.6.5: EdgeWRAP® System
      • 4.6.6: FAQs
    • 4.9: Temporary Bonding
      • 4.9.1: ZoneBOND™ Process
      • 4.9.2: WaferBOND® CR-200
      • 4.9.3: WaferBOND® HT-10.10
    • 4.10: Processing Equipment
      • 4.10.1: Spin Coaters
        • 4.10.1.1: Spin Coater (200X)
        • 4.10.1.3: Heavy-Duty-Drive Spin Coater (300X)
      • 4.10.2: Bake Plates
        • 4.10.2.1: Bake Plate (1300X)
        • 4.10.2.2: 300-mm Bake Plate (10)
        • 4.10.2.3: 450-mm Bake Plate (11)
      • 4.10.3: Developers
        • 4.10.3.1: Developer (200XD)
        • 4.10.3.2: Developer (300XD)
        • 4.10.3.3: Megasonic Developer / Cleaner (300MXD)
      • 4.10.4: Combination Tools
        • 4.10.4.1: Develop-Bake System (200DBX)
        • 4.10.4.2: Coat-Bake System (200CBX)
      • 4.10.5: Flange Mount Systems
      • 4.10.6: Wafer Debonders
        • 4.10.6.1: Slide Debonder (1300DB)
        • 4.10.6.2: ZoneBOND™ Separation Tool
        • 4.10.6.3: Slide Debonder (1300CSX)
      • 4.10.7: EdgeWRAP® System
      • 4.10.10: Automated Bottle Filling System
      • 4.10.11: Processing Theory
      • 4.10.14: Equipment FAQs
      • 4.10.16: Testimonials
    • 4.11: Carbon Nanotube Solutions
    • 4.12: High-Refractive Index
    • 4.15: Planarization Solutions
    • 4.16: Etch Protection Solutions
    • 4.17: Alignment Coatings
    • 4.18: FAQs
      • 4.18.1: Advanced Packaging FAQs
      • 4.18.2: Lithography FAQs
      • 4.18.3: MEMS FAQs
      • 4.18.4: Equipment FAQs
      • 4.18.5: LED FAQs
  • 6: Research
    • 6.1: Publications
    • 6.2: Patents
    • 6.3: Processing Theory
      • 6.3.1: Bake Plate Overview
      • 6.3.2: Bake Plate Process Theory
      • 6.3.3: Spin Coater Theory
      • 6.3.4: Processing Equipment
  • 8: Company
    • 8.3: Vision
    • 8.7: Global Operations
      • 8.7.1: North America
      • 8.7.2: Asia
      • 8.7.3: Europe
    • 8.8: Quality
      • 8.8.1: Customer Satisfaction
      • 8.8.2: Customer Quality Report Portal
      • 8.8.3: Registrations
    • 8.11: Testimonials
    • 8.13: Media
  • 9: Contact Us
    • 9.4: Global Operations
  • 27: Blog
Find us on:
  • Low-Stress Debonding

    Brewer Science® ZoneBOND™ —
    the revolutionary thin wafer handling process from Brewer Science

  • Brewer Science Blog

    Learn how to mitigate microfabrication issues from our industry experts

  • Extend the Life of Your Tools

    Brewer Science® OptiStack® systems can take your technology to the 20-nm node and beyond

  • ZoneBOND™
    the revolutionary thin wafer handling system
    from Brewer Science

    • Excellent total thickness variation
    • High-temperature stability
    • Low-stress debonding

    Learn More »

  • Learn from our
    industry experts at the

    Brewer
    Science
    Blog

  • OptiStack® Systems

    The Brewer Science® OptiStack® system of products is a combination of materials, software and process support that is the leading choice for sub–20 nm processing and delaying the implementation of costly EUV processes.

    Learn More about Brewer Science OptiStack Systems

Brewer Science News

Jan 3, 2012
Gov. Nixon Visits Brewer Science to Announce Appointment of Jason Hall as Director of Missouri Department of Economic Development
Dec 5, 2011
Brewer Science and SUSS Microtec Announce New Agreement
Dec 1, 2011
Brewer Science is at SEMICON Japan

Brewer Science Upcoming Events

2012 Semicon Korea / LED Korea 2012

February 7-9, 2012 in Seoul, Korea

SPIE Advanced Lithography

Visit us at Booth 225

SEMICON China

March 20-22 2012
Visit us at booth 3507

Brewer Science Blog

  • Supply chain flexibility for 3D device packaging
  • Protecting key device features during wet-etch processing
  • Planarization: Leveling extreme topography for microelectronics
  • Overcoming spin-coating challenges for square substrates

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