December 13-15, 2016
San Francisco, CA
December 13-15, 2016
San Francisco, CA
Brewer Science will be presenting at the 13th Annual 3D Architectures for Semiconductor Integration and Packaging in San Francisco, California.
Presentation: Temporary Wafer Bonding Technology for Advanced Packaging
Session: Equipment and Materials
4:40PM – 5:00PM | Wednesday, December 14th, 2016
Dongshun Bai, Brewer Science
Emerging Brewer Science Technologies at 3D ASIP
Wafer-Level Packaging
Conference Website: http://3dasip.org