3D ASIP

December 13-15, 2016

December 13-15, 2016
San Francisco, CA

Brewer Science will be presenting at the 13th Annual 3D Architectures for Semiconductor Integration and Packaging in San Francisco, California.

dongshunbai_smallPresentation: Temporary Wafer Bonding Technology for Advanced Packaging
Session: Equipment and Materials
4:40PM – 5:00PM | Wednesday, December 14th, 2016
Dongshun Bai, Brewer Science

Emerging Brewer Science Technologies at 3D ASIP
Wafer-Level Packaging

Conference Website: http://3dasip.org

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