Advanced Packaging & System Integration Technology Symposium (Yole & NCAP) 2017

April 20-21, 2017

yoleApril 20-21, 2017
Wuxi, China

 

The Advanced Packaging Symposium is hosted and organized by Yole Développement and the National Center for Advanced Packaging (NCAP China).

All aspects of Advanced Packaging, including Fan Out Packaging, System in Package, Advanced Substrates, 3D Technology & Embedded Technologies, as well as MEMS & Sensors packaging, RF, and Photonics will be discussed.

Brewer Science’s Chief Technical Officer, Tony D. Flaim, is the keynote speaker Friday 21st of April:

Materials, Processes and Applications

9:00 – 9:45 – KEYNOTE: The Evolution of Material & Process Strategies for Handling Wafer Level Packaging Substrates
Tony D. Flaim, Chief Technical Officer, Brewer Science

Schedule a time to meet at the conference or ask a question about a featured product:



For more information: Conference Website