The Cee^® 300MXD megasonic developer/cleaner combines an intuitive Windows^®-based operating system, megasonic transducer (ProSys MegPie), extremely accurate spin speed control, and a high-horsepower drive for aggressive acceleration. The radial megasonic array is specifically designed to apply uniform acoustic energy to spinning substrates. The Cee^® 300MXD tool features a complementing stream puddle dispense for supplying developer/cleaner solutions to the wafer surface. These features combine to ensure enhanced development resolution and to mitigate risk to fragile device structures. This tool is also capable of removing < 0.15-µm particles when configured for post-develop or chemical-mechanical polishing (CMP) cleaning applications. The Cee^® 300MXD developer/cleaner has a state-of-the-art user interface and has been designed specifically for wafer sizes ranging from 3 inches to 450 mm and for large LCD squares up to 14 in × 14 in.

Benefits

• Onboard PC control for enhanced interface capabilities and connectivity Windows^®-based operating system
• Enhanced Lid-lift assist feature (gas spring opens ≥45°)
• Stand alone cabinet and streamlined design for minimized footprint (Chemical Storage)
• X-PRO Workstation integrates stand alone cabinet with an upper exhaust enclosure for creating mini-environment (monitors and data logs ambient conditions)
• Flexible configuration for enhanced developing and cleaning applications for fragile device structures
• Stand-alone cabinet and streamlined design for minimized footprint
• Full-color, 7-inch touch screen display
• Drive system (indirect) with highest horsepower in its class

Enhanced Process Applications^*

• Photoresist developing to produce high-aspect-ratio features for MEMS and advanced lithography (KrF/ArF)
• Thick-film SU8 developing
• Post-develop cleaning
• Post-CMP cleaning
• Photomask cleaning
• Photoresist stripping
• Metal lift-off (heated dispense optional)
• Metal etching (heated dispense optional)

Dispense Options

Stream Dispense (Puddle)

This option uses a standard automated center dispense option with pressure cans. It functions by “streaming” the developer and DI water onto the top of the substrate.

The stream dispense option is:

• Is very economical
• Uses precision dispense valves with suckback control
• Minimizes material usage
• Is compatible with aqueous and solvent-based materials

Stream DI Water/Solvent Rinse

Brewer Science offers both topside and backside rinse options for cleaning applications. This dispense method is normally used in conjunction with a pressure dispense can or with a house DI water supply.

Specifications

Dimensions

• Machine weight: 175 lb
• Shipping weight: 450 lb
• Cabinet dimensions: 35.75 in L × 29.0 in D × 59.50 in H

Programmability

• PC-controlled Windows^® operating system)
• System capable of controlling ProSys MicroPulse host software for ProSys’s high-end Megasonic system.
• User-friendly touch screen interface and display
• 250,000 spin process programs
• Virtually an unlimited number of steps per spin program
• 0.1-second resolution for step times (time: 0-9,999.9 s/step)
• Spin speeds of 0-6,000 rpm (optional 4000 rpm and 3000 rpm for additional acceleration capabilities)
• Spin speed accelerations:
  0-30,000 rpm/s unloaded
  0-23,000 rpm/s 300-mm substrate
  0-3,000 rpm/s 350 mm × 6 mm round recessed spin chuck
  0-300 rpm/s 14 in × 14 in × .250 in photomask recessed chuck
• Connectivity: USB/Ethernet port for communications for uploading/downloading process parameters with offline firmware standard (offline recipe number and steps unlimited)
• Simultaneous trigger of multiple (up to 16) automated dispense nozzles
• Bidirectional speed control/oscillating chuck
• Iteration software (recipe looping)
• Dispense or component outputs: 50
• Security: Password protection option at no charge
• In-process, dynamic speed acceleration control

Precision

• Spin speed repeatability: < 0.2 rpm
• Spin speed resolution: < 0.2 rpm
• Substrate sizes: < 3 in to 450 mm round/14 in × 14 in square)

Reliability

• Indirect drive system protects the spin motor from accidental contact with process chemical and solvents.
• Vacuum and lid interlock standard
• Industry-leading reliability and uptime
• 1-year full warranty on parts and labor
• Free live technical phone support for the life of the product
• Application process assistance (live) for the life of the product

Bowl, Exhaust Hood, & Megasonic Transducer Design

• All stainless steel construction
• Drain and exhaust ports located in the bottom of bowl
• Optional ETFE-coated spin bowl for material compatibility
• Optional sapphire MegPie array for material compatibility
• Optional Teflon^®/polyethylene bowl non-disposable bowl liner
• Optional exhaust hood (process chamber)
• Optional fan filter unit (< Class 1 cleanliness inside process chamber)
• Optional Teflon^®/polyethylene splash ring
• Optional nitrogen purge for an inert spin environment
• Optional automatic N₂ blow-off nozzle
• Optional automatic drain separator (to separate aqueous and solvent-based fluids)

Utilities

• Power requirements: 200-240 Volts A/C, 2350 Watts, 12.0 AMP
• Drain port: 1 in OD
• Exhaust port: 1.5 in OD
• Recommended utilities: Vacuum: 20 in Hg, Exhaust 20-50 cfm
• Auto-Dispense requirements: N₂ or CDA: 70 psi (15 lpm)
• Maximum flow for DI water for developer spray and backside rinse (if hard-plumbed): 80 psi, regulator to be supplied by purchaser

* - Patent-pending technology