Apogee™

Introducing the new Cee® Apogee tool line with Datastream Technology

Spin Coater

With Datastream Technology

Apogee Spin Coater

The Brewer Science® Cee® Apogee precision spin coater delivers track-quality performance with revolutionary interface capabilities and the utmost in chemical compatibility in an efficient, space-saving design.

Download Datasheet Here

Benefits

  • New, compact design for minimized footprint
  • Full-color, 7-inch touch screen display
  • High-density polyethylene (HDPE) spin bowl for maximum chemical compatibility
  • Durable benchtop design that can be converted to a flange-/deck-mountable configuration (mountable in the Cee® X-Pro II workstation)
  • DataStream™ technology as the standard interface

Bake Plate

With Datastream Technology

Apogee Bake Plate

The Brewer Science® Cee® Apogee bake plate features a revolutionary intuitive interface, a space-saving design, and track-quality thermal accuracy and uniformity..

Download Datasheet Here

Benefits

  • New compact design for minimized footprint
  • Full-color, 7-inch touch screen display
  • Durable benchtop design that can be converted to a flange-/deck-mountable configuration
  • Hot plate cover that is cool to the touch, adding extra safety benefits
  • Adjustable exhaust
  • Programmable lift pins are now standard
  • DataStream™ technology as the standard interface

Bonder

With Datastream Technology

Apogee Bonder

The Brewer Science® Apogee bonder is fully programmable and user-friendly. It enables precision temporary bonding for a wide array of wafer sizes.

Download Datasheet Here

Benefits

  • Substrate size range: 50-300 mm
  • Dual rigid platens heat wafer stack from both sides, minimizing thermal defects
  • Ultraflat self-leveling platens minimize total thickness variation (TTV)
  • Evacuated bond chamber eliminates voids
  • Carrier and device are separated during pre-bond evacuation
  • Total thickness variation: < 10%

Debonder

With Datastream Technology

Apogee Debonder

Coming Soon..