Temporary Bonding System

The Brewer Science<sup>®</sup> Apogee<sup>™</sup> Bonder - Temporary Bonding System The Brewer Science® Apogee bonder is fully programmable and user-friendly. It enables precision temporary bonding for a wide array of wafer sizes.


  • Substrate size range: 50-300 mm
  • Dual rigid platens heat wafer stack from both sides, minimizing thermal defects
  • Ultraflat self-leveling platens minimize total thickness variation (TTV)
  • Evacuated bond chamber eliminates voids
  • Carrier and device are separated during pre-bond evacuation
  • Total thickness variation: < 10%

Temporary Wafer Bonding Tool Platform Reliability
Total ThroughputEst. 8-14 WPH for ≤150-mm diameter*
Est. 4-8 WPH for 200-300-mm diameter
Qualified Wafer MaterialsSiC, GaN, GaAs, InP, sapphire, silicon, glass
System Uptime>99% over a 12-month period
Mean Time to Repair (MTTR)< 24 hours
Mean Time between Failures (MTBF; hours, cycles)>600 hours, 6,000 cycles

Temporary Bonding Equipment Suite