T-Polyim™ layers are a family of polyimide materials designed to provide extremely transparent, durable coatings at a range of thicknesses. They are ideally suited as passivation layers on top of silicon circuitry prior to the deposition of color filter materials. They may also be used as a "smoothing" layer on top of color filters prior to the deposition of ITO. T-Polyim™ materials may be patterned using photoresist and a ß-bake process. Benefits that T-Polyim™ materials provide include:

• Ultrapure polyimide with lower metal ion contamination and higher clarity than other commercially available polyimides.
• Consistent and repeatable performance characteristics due to extensive quality control during and after manufacturing.
• Improved adhesion on oxide, silicon, silicon nitride, aluminum, and copper for fully cured films. Beta stage cured T-Polyim™ films show improved adhesion in etching during photoresist development.
• Excellent thermal and superior electrical properties.
• Can produce single coat, spun films up to 6µm thick (after curing) when processed as recommended.
• Can be formulated in many viscosities to achieve the specifications needed for special process requirements.
• Supported with Brewer Science’s in-house chemical and lithography laboratories and experienced process engineers.