Lift-off Layer Application - 365nm
WiDE-B is specifically designed for wet patterning, which eliminates the need for a substrate adhesion promoter and separate BARC etch. The extended bake latitude and advanced optical characteristics allow the wet-patterning process to achieve 0.35-0.40µm patterns. WiDE is especially useful as a platform for a separation layer that serves as a lift-off application in devices such as surface acoustic wave guides (SAWs).
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