STI Application - 365nm
ARC i-CON® is a highly conformal product designed to address issues of coverage and over-etch. It offers a 30% faster etch rate than most advanced i-line photoresists. This series delivers exceptional optical properties through the control of substrate reflectivity, which improves CD resolution. At 0.35µm features, the series produces excellent profiles and has demonstrated feature sizes of 0.25µm with PFI-88.
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XHRiC is a highly robust product line specifically designed for advanced i-line dry-patterning processes. This optical design, with an n value of 1.84 and a k value of 0.34, exhibits excellent absorbance. These products have been employed in poly, gate, and metallization levels for 0.30-0.35µm design rule devices. With continuous improvements in lithography technologies, 0.25µm feature sizes have been resolved.
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