Trench Fill Application - All

ARC29A is a leading anti-reflective coating for 193nm photolithography. This second minimum material is compatible with a broad range of ArF photoresists. It is available in formulations for 200mm and 300mm processes.
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ARC82A is a leading-edge 193nm anti-reflective coating designed for improved depth of focus with advanced ArF photoresists. This second minimum BARC is compatible with FujiFilm, JSR, Sumitomo, and TOK photoresists.
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DUV52 family is specifically designed to be compatible with ESCAP DUV photoresists and is used in the dual damascene process. Its planarizing characteristics ensure better control of resist thickness over steps to minimize reflective notching and improve CD control.
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DUV54 was designed for use in dual damascene processes and is compatible with acetal DUV photoresists. Its planarizing characteristics ensure the ability to acheive better control of resist thickness over steps to minimize reflective notching and improve CD control.
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DUV112 is the latest product in Brewer Science’s BARC product family line. This product is specifically designed for certain devices that require a BARC with very few defects. DUV112 has demonstrated extremely high resolution, broad resist compatibility, high etch rate, excellent shelf life in normal storage conditions, and processing ease.
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