Via Fill Application - 248nm

DUV52 family is specifically designed to be compatible with ESCAP DUV photoresists and is used in the dual damascene process. Its planarizing characteristics ensure better control of resist thickness over steps to minimize reflective notching and improve CD control.
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DUV54 was designed for use in dual damascene processes and is compatible with acetal DUV photoresists. Its planarizing characteristics ensure the ability to acheive better control of resist thickness over steps to minimize reflective notching and improve CD control.
Path: /Products/ARC®/Product Information/248nm Products