Via Printing Application - 248nm
DUV42P is compatible with ESCAP photoresists. DUV42P utilizes a conformal design and an increased etch rate while optimizing step coverage. DUV42P is optimized to meet the requirements of the <0.10µm design rule.
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DUV44 is designed for <0.18µm design rules. DUV44 demonstrates excellent profiles with a broad range of acetal photoresists. This product provides a highly conformal, fast-etching BARC layer.
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DUV52 family is specifically designed to be compatible with ESCAP DUV photoresists and is used in the dual damascene process. Its planarizing characteristics ensure better control of resist thickness over steps to minimize reflective notching and improve CD control.
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DUV54 was designed for use in dual damascene processes and is compatible with acetal DUV photoresists. Its planarizing characteristics ensure the ability to acheive better control of resist thickness over steps to minimize reflective notching and improve CD control.
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DUV64 is a member of the latest generation of anti-reflective coatings. DUV64 demonstrates superior optical properties and coating qualities that allow it to be applied as considerably thinner coatings than previous series materials. The advanced capability of this BARC enables faster throughput time, with a demonstrated etch rate of over two times faster than traditional BARCs.
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DUV112 is the latest product in Brewer Science’s BARC product family line. This product is specifically designed for certain devices that require a BARC with very few defects. DUV112 has demonstrated extremely high resolution, broad resist compatibility, high etch rate, excellent shelf life in normal storage conditions, and processing ease.
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