Via Printing Application - 365nm
ARC i-CON® is a highly conformal product designed to address issues of coverage and over-etch. It offers a 30% faster etch rate than most advanced i-line photoresists. This series delivers exceptional optical properties through the control of substrate reflectivity, which improves CD resolution. At 0.35µm features, the series produces excellent profiles and has demonstrated feature sizes of 0.25µm with PFI-88.
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WiDE-B is specifically designed for wet patterning, which eliminates the need for a substrate adhesion promoter and separate BARC etch. The extended bake latitude and advanced optical characteristics allow the wet-patterning process to achieve 0.35-0.40µm patterns. WiDE is especially useful as a platform for a separation layer that serves as a lift-off application in devices such as surface acoustic wave guides (SAWs).
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XHRiC is a highly robust product line specifically designed for advanced i-line dry-patterning processes. This optical design, with an n value of 1.84 and a k value of 0.34, exhibits excellent absorbance. These products have been employed in poly, gate, and metallization levels for 0.30-0.35µm design rule devices. With continuous improvements in lithography technologies, 0.25µm feature sizes have been resolved.
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