Brewer Science Presents “Thin Wafer Handling: Methods and Challenges” at 3D Architectures for Semiconductor Integration and Packaging

December 15, 2015 – Redwood City, CA – Brewer Science Applications Manager Molly Hladik will be a presenter at 3D Architectures for Semiconductor Integration and Packaging (3D ASIP), which will be held December 15-17, 2015, in Redwood City, California. This annual conference, now in its twelfth year, addresses the opportunities and challenges in 3D integration and packaging.

December 15, 2015 – Redwood City, CA – Brewer Science Applications Manager Molly Hladik will be a presenter at 3D Architectures for Semiconductor Integration and Packaging (3D ASIP), which will be held December 15-17, 2015, in Redwood City, California. This annual conference, now in its twelfth year, addresses the opportunities and challenges in 3D integration and packaging.

Dr. Hladik will present, “Thin Wafer Handling: Methods and Challenges” which covers materials and processes designed to overcome the challenges and risks associated with processing ultrathin wafers. “Not all materials and processes are a fit for processing every device,” says Dr. Hladik. “These challenges can be overcome by careful selection of both the bonding material and the debonding process.”

Make plans to hear Dr. Hladik at 3D ASIP at:
“Thin Wafer Handling: Methods and Challenges”
Tuesday, December 15, 2015
Tutorial: Temporary Bonding / Debonding Processes, Materials, and Equipment
9:30 – 10:00 am

Brewer Science continues to create new technologies that enable manufacturers to gain a competitive advantage.

We invite you to learn more about Brewer Science at www.brewerscience.com, follow us on Twitter at @BrewerScience, like us on Facebook, and subscribe to our blog.

About Brewer Science
Brewer Science is a global technology leader in developing and manufacturing innovative materials, processes, and equipment for the reliable fabrication of cutting-edge microdevices used in electronics such as tablet computers, smartphones, digital cameras, televisions, LED lighting, and flexible technology products. In 1981, Brewer Science revolutionized lithography processes with its invention of ARC® materials. Today, Brewer Science continues to expand its technology portfolio to include products enabling advanced lithography, thin wafer handling, 3-D integration, and chemical and mechanical device protection and products based on nanotechnology. Brewer Science recently unveiled a new high-volume manufacturing facility at the Rolla National Airport to accommodate increased product demand and demonstrate the company’s commitment to continuous improvement. With its headquarters in Rolla, Missouri, Brewer Science supports customers throughout the world with a service and distribution network in North America, Europe, and Asia.

For more information, contact:
Loretta Wallis
Corporate Relations Manager
Brewer Science
+1.573.364.0300
mwallis@brewerscience.com