China Advanced Packaging Conference
November 12–15, 2012
2012 BIMS & MMCSPT
China National Convention Center (CNCC, Olympics Park)
Beijing, China
Brewer Science is a sponsor and will present our latest thin-wafer-handling technology at the conference November 14, at 10:40 am (CST | Beijing, China).
To learn about ZoneBOND®, the proven thin-wafer-handling technology, click here.