Asia Technology Forums

Join Brewer Science at the SUSS MicroTec Asia Technology Forums to learn about our latest thin-wafer-handling technologies. The Asia Technology Forums will be held on three separate dates at three different locations - Singapore, Hsinchu, Taiwan and Shanghai, China - and will feature speakers from industry leading companies and world-renowned research institutions. 

Brewer Science will present "3-D IC / Temporary Bonding Material Requirements". We hope to see you there!

Singapore, November 15, 2012
Details and Registration

Taiwan, Hsinchu, November 20, 2012
Details and Registration

China, Shanghai, November 22, 2012
Details and Registration

To learn about ZoneBOND^®, the proven thin-wafer-handling technology, click here.