Processing Equipment

Brewer Science processing equipment is used in the development of technologies such as: Semiconductor processing, MEMS Processing, Chip-Stacking, Thin-Film Technology, Sensors Processing, and Advanced Packaging processes.

With an installed base exceeding 2,000 units, the Cee® product line offers the flexibility needed to process a variety of applications.

Spin Coaters

  • Cee® 200X precision spin coater
  • Cee® 200X Precision Spin Coater

    Cee® 200X precision spin coater

    The Brewer Science ® Cee® 200X spin coater features a space-saving design, onboard PC controller, full-color touch screen interface, and virtually unlimited recipe storage.  By using a unique indirect drive system, Cee® spin coaters virtually eliminate risk associated with process chemicals and solvents contacting the spin motor and causing permanent damage.  This critical feature ensures industry-leading reliability and uptime for our customers.

    The Cee® 200X spin coater configuration includes a lid that can also be exhausted and/or N2 purged for greater environmental control.  The Cee® 200X spin coater is capable of spin coating substrates up to 7” square or 200-mm round and features high torque for maximum ramping capability.  You can also spin coat smaller size substrates (<1-cm through 200-mm) using a wide array of spin-coating chuck sizes.  We offer three separate torque/speed options for accommodating specific loads.  

    Programmability

    • PC-controlled
    • Touch screen interface and display
    • Full-color alphanumeric-capable graphical user interface
    • 250,000 process recipe programs on board
    • A virtually unlimited number of user-defined recipe program steps
    • 0.1-second resolution for step times (9,999.9 seconds maximum step time)
    • Spin speed: 0 to 6,000 rpm (12,000 rpm option at no charge; 16,000 rpm option available)
    • Spin speed acceleration:
    • 0 to 30,000 rpm/s unloaded
    • 0 to 23,000 rpm/s 200-mm substrate
    • 0 to 3,000 rpm/s 6" x 6" x 0.250" photomask recessed chuck
    • Connectivity: USB/ethernet port for communications for uploading/downloading coating process parameters with offline firmware standard (unlimited number of offline recipes and recipe steps)
    • System capable of controlling third-party host software for high-end IDI/Cybor/Mykrolis positive displacement pumps
    • Simultaneous dual automated dispense capability
    • Bidirectional speed control/oscillating chuck
    • Iteration software (recipe looping)
    • Dispense or component outputs: 50
    • Security: Password protection option available at no charge
    • In-process/dynamic speed/acceleration control

    Precision

    • Spin speed repeatability: < 0.2 rpm
    • Spin speed resolution: < 0.2 rpm
    • Substrate sizes: < 1 cm to 200 mm round; 7"x7" square

    Reliability

    • Indirect drive system protects the spin motor from contact with process chemicals and solvents
    • Vacuum and lid interlock
    • Industry-leading reliability and uptime
    • 1-year full warranty on parts and labor
    • Free remote technical support (phone, email, fax) for the life of the product
    • Application process assistance for life of the product

    Bowl Design

    • Teflon® spin bowl for expanded material compatibility
    • Integrated bowl ring to eliminate material migration
    • Optional stainless steel bowl (for all-stainless-steel construction)
    • Optional polyethylene bowl (educational package) available
    • Optional polyethylene liners available
    • Optional polyethylene/Teflon® splash ring
    • Closed and optional open lid designs for process flexibility
    • Drain and exhaust ports located in the bottom of bowl
    • Optional nitrogen purge for an inert spin environment

    Dimensions

    • 13.25" W x 19" D x 12" H (33.65 cm W x 48.26 cm D x 30.48 cm H)
    • Machine weight: 40 lb (18.14 kg)
    • Shipping weight: 100 lb (45.36 kg)

    Utilities

    • Voltage ranges: 100, 110-125, 208-240 VAC, 50/60 Hz
    • Power requirements: 655 Watts
    • Drain port: 0.75" OD
    • Exhaust port: 1" OD
    • Vacuum: 20 to 25" Hg
    • Exhaust: 20 to 50 cfm at 0.2" water
    • Nitrogen or CDA (for automated dispense): 70 psi
    ×
  • Cee® 300X heavy-duty-drive precision spin coater
  • Cee® 300X Heavy-Duty-Drive Spin Coater

    Cee<sup>®</sup> 300X heavy-duty-drive spin coater shown with X-Pro package

    Shown with optional X-Pro configuration

    The Brewer Science® Cee® 300X heavy-duty-drive spin coater combines an intuitive Windows®-based operating system, extremely accurate spin speed control, and a high horsepower drive for aggressive acceleration. These features combine to ensure the elimination of process variables for a large array of process chemicals and applications. The 300X has a state-of-the-art user interface and has been designed specifically for 300-mm and larger LCD squares up to 14” × 14”.

    Benefits

    • Onboard Windows®-based PC control for enhanced interface capabilities and connectivity
    • Enhanced Lid-lift assist feature (gas spring opens ≥45°)
    • Stand alone cabinet and streamlined design for minimized footprint (Chemical Storage)
    • X-PRO Workstation integrates stand alone cabinet with an upper exhaust enclosure for creating mini-environment (monitors and data logs ambient conditions)
    • New compact design for minimized footprint
    • Full-color, 7-inch touch screen display
    • Drive system (indirect) with highest horsepower in its class

    Programmability

    • PC-controlled
    • Touch screen interface and display
    • 250,000 process recipe programs on board
    • A virtually unlimited number of user-defined recipe program steps
    • 0.1-second resolution for step times (9,999.9 seconds maximum step time)
    • Spin speed: 0 to 6,000 rpm (4000 rpm and 3000 rpm option available for additional acceleration capabilities)
    • Spin speed acceleration:
      0 to 30,000 rpm/s unloaded
      0 to 23,000 rpm/s 300-mm substrate
      0 to 3,000 rpm/s 350-mm × 6-mm round recessed spin chuck
      0 to 400 rpm/s 14-in × 14-in × 1.1-mm in photomask recessed chuck
    • Connectivity: USB/ethernet port for communications for uploading/downloading process parameters with offline firmware (offline recipe number and steps unlimited)
    • System capable of controlling third-party host software for high-end IDI/Cybor/Mykrolis positivie displacement pumps
    • Capabilities to simultaneously-trigger multiple (up to 16) automated dispense nozzles
    • Bidirectional speed control/oscillating chuck
    • Iteration software (recipe looping)
    • Dispense or component outputs: 50
    • Security: Password protection option available at no charge
    • In-process dynamic speed acceleration control

    Precision

    • Spin speed repeatability: < 0.2 rpm
    • Spin speed resolution: < 0.2 rpm
    • Substrate sizes < 1 cm to 450 mm round; 14 in × 14 in square

    Reliability

    • Indirect drive system protects the spin motor from contact with process chemicals and solvents
    • Vacuum and lid interlock
    • Industry-leading reliability and uptime
    • 1-year full warranty on parts and labor
    • Free remote technical support (phone, email, fax) for the life of the product
    • Application process assistance for life of the product

    Bowl and Exhaust Hood Design

    • All stainless steel construction
    • Optional ETFE-coated spin bowl for material compatibility
    • Optional Teflon®/polyethylene bowl (non-disposable bowl liner)
    • Optional closed and open lid design for process flexibility
    • Optional Teflon®/polyethylene splash ring
    • Drain and exhaust ports located in the bottom of bowl
    • Optional nitrogen purge for an insert spin environment

    Dimensions

    • Machine weight: ~115 lb (52.2 kg)
    • Shipping weight: ~250 lb (113.4 kg)
    • Cabinet dimensions: 27.75 in (70.5 cm) W × 34.75 in
      (88.3 cm) L × 20.25 in (51.5 cm) H

    Utilities

    • Power requirements: 200-240 VAC, 1350 watts, 7.0 amp
    • Drain port: 1 in OD
    • Exhaust Port: 1.5 in OD
    • Vacuum: 20-25 in hg
    • Exhaust: 20-50 cfm at 0.2 in water
    • Nitrogen or CDA (for automated dispense): 70 psi
    ×

Bake Plates

  • Cee® 1300X precision bake plate
  • Cee® 1300x Precision Bake Plate

    Brewer Science® Cee® 1300X Precision Bake Plate

    The Brewer Science® Cee® 1300X precision bake plate features a revolutionary intuitive interface, a space-saving design, and track-quality thermal accuracy and uniformity.

    Fully programmable and user-friendly, the Brewer Science® Cee® 1300X precision bake plate features the accuracy and repeatability needed to eliminate processing variability from critical experiments. Recipes are easily entered, monitored, and stored with the convenient full-color touch screen interface, and onboard Windows®-based PC controller. Compact footprint, intuitive design, and unequaled experience add up to years of high-performance bake step processing, perfect for any low-volume or R&D laboratory processing environment.

    Benefits

    • Onboard Windows®-based PC control for enhanced interface capabilities and connectivity
    • New compact design for minimized footprint
    • Full-color, 7-inch touch screen display
    • Durable wet-bench design that can be converted to a flange/deck mountable configuration
    • Enhanced logging and programmable height control

    Dimensions

    • 13.25" W x 19" D x 12" H (33.65cm W x 48.26cm D x 30.48cm H)
    • Machine weight: 65 lb (29.48 kg)
    • Shipping weight: 148 lb (67.13 kg)

    Programmability

    • Controlled by onboard Windows®-based PC
    • Touch screen interface and display
    • 250,000 bake process programs
    • Virtually unlimited steps per program
    • 0.1-s resolution for step times with a range of
    • 0 to 9,999.9 s/step
    • Three automated bake methods: contact, vacuum, proximity
    • Bake plate auto sizing for 3-in, 100-, 125-, 150-, and 200-mm  substrates
    • Temperature data recording
    • Ethernet port for network connectivity and uploading/downloading process parameters
    • Password protection available at no charge
    • Ramping capability optional (8 specific set points within single bake recipe)
    • Optional electronic lift pins (replace N2 proximity for loading/unloading substrates from bake module). Program 10 specific proximity heights above the surface in any sequence or combination. Height is programmed in 0.001" increments with an overall range of 0.000" to 0.500"
    • Energy-saving capability (for predetermined temperature output control)

    Precision

    • Substrate sizes: < 1 cm to 200 mm round; 8" x 8" square)
    • Temperature resolution: 0.1° C
    • Temperature range: ambient to 300°C (400°C optional)
    • Temperature uniformity: ± 0.3% across working surface

    Reliability

    • Exceptional reliability and up-time
    • 1-year full warranty parts and labor
    • Free technical (live) phone support for the life of the product
    • Application process assistance (live) for life of the product
    • Exhaust bake hood design
    • All stainless steel construction
    • Exhausted hood for removal of process chemicals
    • Optional nitrogen purge for inert bake environment

    Utilities

    • Voltage ranges: 100, 110-125, 208-240 VAC
    • Power requirements: 1057, 1683, 1555 watts per plate
    • (16.7 amps)
    • Exhaust port: 1" OD
    • Vacuum: 20 to 25 in Hg
    • Exhaust: 5 to 10 cfm
    • N2 (for bake plate proximity): 35 psi
    ×
  • Cee® 10 large-area (300-mm) bake plate
  • Cee® 10Large-Area Bake Plate

    Cee® 10 Bake Plate

    The Brewer Science® Cee® 10 hot plate is designed for process and R&D engineers requiring a hot plate for substrate applications. The Cee 10 hot plate has capability for 300 mm or 14"³ square (maximum) substrates. This provides the user with repeatable thermal performance in a robust system design for years of reliable operation.

    Programmability

    • Dual 4-digit alphanumeric LED display
    • Full PID operation
    • Temperature auto-tuning capable
    • Security: Password protection option at no charge
    • Ramping capability optional (8 specific set points)

    Operation

    • Pneumatic Lift pin Option (Load/Unload) Standard
    • Removable Fixed Proximity Standoffs (.020" Standard)
    • Contact or Fixed Proximity Bake Method Standard
    • Vacuum and Proximity Bake for 200 and 300mm Wafers Optional
    • Optional Custom Hot Plate Surfaces Available Upon Request

    Precision

    • Substrate sizes: 300 mm round, 14" x 14" square
    • Temperature resolution: 0.1°C
    • Temperature range: Ambient to 300°C (400°C optional)
    • Temperature uniformity: ± 0.3% across working surface

    Exhaust Bake Hood Design (Optional)

    • All stainless steel construction
    • Exhaust hood for removal of process chemicals
    • Optional nitrogen purge for an inert bake environment

    Dimensions

    • Machine weight: 77 lb (35 kg)
    • Shipping weight: 210 lb (95.5 kg)
    • Cabinet dimensions: 18.75" W x 18.75" D x 9.5" H (47.7 cm W x 47.7 cm D x 24.2 mm H)

    Utilities

    • Power requirements: 208 to 240 volts A/C, 3005 to 4005 watts
    • Full load current: 14.4 to 16.7 amps
    • Input breaker/fuse: 20 amps
    • Optional exhausted lid port: 2" OD
    • Optional exhausted lid: 10 to 30 cfm range

    Reliability

    • Exceptional reliability and up-time
    • 1-year full warranty parts and labor
    • Free technical phone support for the life of the product
    • Application process assistance for life of the product
    ×
  • Cee® 11 large-area (450-mm) bake plate
  • Cee® 11Large-Area Bake Plate

    Cee® 11 Bake Plate

    The Brewer Science® Cee® Model 11 bake plate is specifically designed for large area substrates, up to 450-mm round and 20-in square. It provides process and R&D engineers with the utmost in thermal accuracy and uniformity. The footprint is compact, so it installs seamlessly within existing clean room hoods or on laboratory table surfaces.

    Operation

    • Pneumatic lift pin (load/unload) standard
    • Removable fixed proximity standoffs (0.006” standard)
    • Contact or fixed proximity bake methods (standard)
    • Optional vacuum and proximity bake for 300- and 450-mm
    • wafers
    • Optional custom bake plate surfaces available upon request

    Programmability

    • Dual 4-digit alphanumeric LED display
    • Full PID operation
    • Temperature auto-tuning capable
    • Security: password protection option at no charge
    • Optional ramping capability (8 specific set points)

    Precision

    • Maximum Substrate Sizes: < 1cm to 450-mm round; 20” × 20” square
    • Temperature Resolution: 0.1°C
    • Temperature Range: ambient to 200°C (250°C optional)
    • Temperature Uniformity: ± 0.3% across working surface

    Dimensions

    • Machine Weight: 150 lb
    • Shipping Weight: 280 lb
    • Cabinet Dimensions: 24.938 in L × 24.938 in W × 9.5 in H

    Reliability

    • Industry-leading reliability and uptime
    • 1-year full warranty on parts and labor
    • Free remote technical support (phone, email, fax) for the life of the product
    • Application process assistance for life of the product

    Exhaust Bake Hood Design

    • All stainless steel construction
    • Optional exhausted hood for removal of process chemicals
    • Optional nitrogen purge for inert bake environment

    Utilities

    • Power requirements: 208 to 240 volts AC, 2351-3130 watts
    • Full load current: 12.5 to 15.5 amps
    • Input breaker/fuse: 20 amps
    • Optional exhausted lid port: 2-inch OD
    • Optional exhausted lid: 10- to 30-cfm range
    ×

Developers

  • Cee® 200XD spray/puddle developer
  • Cee® 200XD Spray & Puddle Developer

    Brewer Science® Cee® 200XD Developer

    The Brewer Science® Cee® 200XD puddle and spray developer delivers track-quality performance, a revolutionary touch screen interface, and the utmost in chemical and process flexibility, in an efficient, space-saving design.

    Benefits

    • Spray, puddle, and stream systems available
    • Onboard Windows®-based PC control for enhanced
      interface capabilities and connectivity
    • Configurable for direct-angle continuous and/or side-angle spray puddle develop
    • New compact design for minimized footprint
    • Full-color, 7-inch touch screen display
    • Teflon® spin bowl for maximum chemical compatibility
    • Durable wet-bench design that can be converted to a flange/deck mountable configuration

    Developer Options

    Spray Dispense (Puddle/Direct)

    This option utilizes two spray nozzles to apply developer solution and deionized (DI) water. It uses an open UHMW lid with spray nozzles mounted either outside the wafer plane, spraying inward from the center of the wafer out (puddle spray), or directly over the substrate for continuous (direct) spray applications.

    • Uses 1-gallon pressure cans as reservoirs for developer solutions
    • Can use a maximum of four spray nozzles
    • Can be configured to accommodate up to four center puddle/direct dispenses

    Stream Dispense (Puddle)

    This option uses a standard automated dispense spinner and pressure cans. It functions by streaming developer and DI water onto the top of the substrate.

    • Very economical
    • Utilizes standard auto-dispense Lexan® lid
    • Uses suckback dispense valves
    • Minimizes material usage

    DI Water Rinse

    Both topside and backside DI water rinse options are available. This method of dispense is normally used in conjunction with a pressure can dispense or by using a house DI water supply.

    Specifications

    Programmability

    • Controlled by onboard Windows®-based PC
    • Touch screen interface and display
    • Full-color alphanumeric-capable graphical user interface (GUI)
    • 250,000 process recipe programs on board
    • Virtually unlimited number of user-defined recipe program steps
    • 0.1-second resolution for step times (maximum step time: 9,999.9 seconds)
    • Spin speed: 0 to 6,000 rpm (12,000 rpm option at no charge; 16,000 rpm option available)
    • Spin speed acceleration:
      0 to 30,000 rpm/s unloaded
      0 to 23,000 rpm/s with a 200-mm substrate
      0 to 3,000 rpm/s with a 6" x 6" x 0.25" photomask recessed chuck
    • USB and Ethernet ports for network connectivity and uploading/downloading process parameters with offline firmware (offline recipe number and steps unlimited)
    • System capable of controlling third-party host software for high-end IDI/Cybor/Mykrolis positive displacement pumps
    • Simultaneous dual automated dispense capability
    • Bidirectional speed control/oscillating chuck
    • Iteration software (recipe looping)
    • Dispense or component outputs: 50
    • Password protection security option available at no charge
    • In-process dynamic speed/acceleration control

    Precision

    • Spin speed repeatability: < 0.2 rpm
    • Spin speed resolution: < 0.2 rpm
    • Substrate sizes: < 1 cm to 200 mm round; 7 inch x 7 inch square

    Reliability

    • Indirect drive system protects the spin motor from contact with process chemicals and solvents
    • Vacuum and lid interlock
    • Industry-leading reliability and uptime
    • 1-year full warranty on parts and labor
    • Free remote technical support (phone, email, fax) for the life of the product
    • Application process assistance for life of the product

    Bowl Design

    • Teflon® spin bowl for material compatibility
    • Integrated bowl ring to eliminate material migration
    • Optional stainless steel bowl (for all-stainless-steel construction)
    • Optional polyethylene bowl (educational package) available
    • Optional polyethylene liners available
    • Optional polyethylene/Teflon® splash ring
    • Closed and open lid designs available for process flexibility
    • Drain and exhaust ports located in the bottom of bowl
    • Optional nitrogen purge for an inert spin environment
    • Optional auto-N2 blow-off nozzle
    • Optional auto-drain separator (solvent/aqueous)

    Dimensions

    • 13.25" W x 19" D x 18" H (33.65 cm W x 48.26 cm D x 45.72 cm H)
    • Machine Weight: 40 lb (18.1 kg)
    • Shipping Weight: 100 lb (45.4 kg)

    Utilities

    • Voltage ranges: 100, 110-125, 208-240 VAC, 50/60 HZ
    • Power requirements: 655 watts (10 amps)
    • Drain Port: 3/4" OD
    • Exhaust Port: 1" OD
    • Vacuum: 20" to 25" Hg
    • Exhaust: 20 to 50 cfm
    • Nitrogen or CDA (for automated dispenses): 70 psi
    • DI water for developer spray and backside rinse (if hard plumbed); maximum flow: 80 PSI; regulator to be supplied by purchaser
    ×
  • Cee® 300XD heavy-duty-drive spray/puddle developer
  • Cee® 300XDSpray & Puddle Developer

    Cee® 300XD spray/puddle developer shown with X-Pro package

    The Brewer Science® Cee® 300XD spray/puddle developer combines an intuitive Windows®-based operating system, extremely accurate spin speed control, and an extremely high horsepower drive for aggressive acceleration. The 300XD spray/puddle developer offers direct fan-jet spray, side-angle puddle, and stream dispense options. These features combine to ensure the elimination of process variables for a large array of process chemicals and applications. The 300XD has a state-of-the-art user interface and has been designed specifically for 300-mm round substrates and large LCD squares up to 14” × 14”.

    Benefits

    • PC control for enhanced interface capabilities and connectivity
    • Enhanced Lid-lift assist feature (gas spring opens ≥45°)
    • Stand alone cabinet and streamlined design for minimized footprint (Chemical Storage)
    • X-PRO Workstation integrates stand alone cabinet with an upper exhaust enclosure for creating mini-environment (monitors and data logs ambient conditions)
    • Direct-angle continuous and/or side-angle spray puddle develop
    • New streamlined design for minimized footprint
    • Full-color, 7-inch touch screen display
    • Highest horsepower drive (indirect) system in its class

    Developer Options

    Spray, puddle and stream dispense options are offered on our Cee® Model 300XD. These dispense methods are normally used in conjunction with a pressure can dispenser which holds the developer.

    Spray Dispense (Puddle/Direct)

    This option utilizes two spray nozzles to apply developer
    solution and deionized (DI) water. It uses an open UHMW lid with spray nozzles mounted either outside the wafer plane, spraying inward from the center of the wafer out (puddle), or directly over the substrate for continuous (direct) spray
    applications.

    • Uses 1-gallon pressure cans as reservoirs for developer solutions
    • Can use a maximum of six spray nozzles
    • Can be configured to accommodate up to four center puddle/direct dispenses

    Stream Dispense (Puddle)

    This option uses a standard automated center dispense option with pressure cans. It functions by “streaming” the developer and DI water onto the top of the substrate.

    • Very economical
    • Utilizes standard auto-dispense Lexan® lid or open developer lid
    • Uses suck back dispense valves
    • Minimizes material usage

    DI Water Rinse

    Both topside and backside DI water rinse options are available. This method of dispense is normally used in conjunction with a pressure can dispense or by using a house DI water supply.

    Specifications

    Programmability

    • PC controlled
    • Touch screen interface and display
    • 250,000 spin process programs onboard
    • Virtually unlimited steps per spin program
    • 0.1 s resolution for step times with a range of
    • 0 to 9,999.9 s /step
    • Spin speed: 0 to 6,000 rpm (4000 rpm and 3000 rpm option  available for additional acceleration capabilities)
    • Spin speed acceleration:
      0 to 30,000 rpm/s unloaded
      0 to 23,000 rpm/s for 300-mm substrate
      0 to 3,000 rpm/s for 350-mm × 6-mm round recessed spin chuck
      0 to 400 rpm/s for 14-in × 14-in × 0.250-in photomask recessed chuck
    • Connectivity: USB/Ethernet port for communication of uploading/downloading process parameters with offline firmware standard (offline recipe number and steps unlimited)
    • System capable of controlling third-party host software for high-end IDI/Cybor/Mykrolis positive displacement pumps
    • Simultaneous trigger of multiple (up to 16) automated dispense nozzle capability
    • Bidirectional speed control/oscillating chuck
    • Iteration software (recipe looping)
    • Dispense or component outputs: 50
    • Security: password protection available at no charge
    • In-process/dynamic speed/acceleration control

    Precision

    • Spin speed repeatability: < 0.2 rpm
    • Spin speed resolution: < 0.2 rpm
    • Substrate sizes: < 1 cm to 450 mm round; 14 in × 14 in square

    Reliability

    • Indirect drive system protects the spin motor from accidental contact with process chemicals and solvents
    • Vacuum and lid interlock
    • Exceptional reliability and uptime
    • 1-year full warranty on parts and labor
    • Free remote technical support (phone, email, fax) for the life of the product
    • Application process assistance for life of the product

    Bowl and Exhaust Hood Design

    • Stainless steel construction
    • Optional ETFE spin bowl for material compatibility
    • Optional polyethylene/Teflon® bowl non-disposable bowl liner
    • Closed and optional open lid design for process flexibility
    • Optional polyethylene/Teflon® splash ring
    • Drain and exhaust ports located in the bottom of bowl
    • Optional nitrogen purge for an inert spin environment
    • Optional auto nitrogen blow-off nozzle
    • Optional auto-drain separator (solvent/aqueous)

    Dimensions

    • 27.75 in (70.5 cm) W × 34.75 in (88.3 cm)  L × 20.25 in (51.5 cm) H
    • Machine Weight: ~115 lb (52.2 kg)
    • Shipping Weight: ~250 lb (113.4 kg)

    Utilities

    • Power requirements: 200-240 VAC, 1350 watts, 7.0 amp
    • Drain port: 1” OD
    • Exhaust port: 1.5” OD
    • Vacuum: 20-25” Hg
    • Exhaust: 20-50 cfm at 0.2” water
    • Nitrogen or CDA (for automated dispenses): 70 psi
    • DI water for developer spray and backside rinse (if hard- plumbed) max flow 80 psi regulator to be supplied by purchaser
    ×
  • Cee® 300MXD megasonic developer/
    cleaner
  • Cee® 300MXD Megasonic Developer/Cleaner

    Cee® 300MXD megasonic developer/cleaner shown with X-Pro package

    The Brewer Science® Cee® 300MXD megasonic developer/cleaner combines an intuitive Windows®-based operating system, megasonic transducer (ProSys MegPie), extremely accurate spin speed control, and a high-horsepower drive for aggressive acceleration. The radial megasonic array is specifically designed to apply uniform acoustic energy to spinning substrates. The Cee® 300MXD tool features a complementing stream puddle dispense for supplying developer/cleaner solutions to the wafer surface. These features combine to ensure enhanced development resolution and to mitigate risk to fragile device structures. This tool is also capable of removing < 0.15-µm particles when configured for post-develop or chemical-mechanical polishing (CMP) cleaning applications. The Cee® 300MXD developer/cleaner has a state-of-the-art user interface and has been designed specifically for wafer sizes ranging from 3 inches to 450 mm and for large LCD squares up to 14 in × 14 in.

    Benefits

    • Onboard PC control for enhanced interface capabilities and connectivity Windows®-based operating system
    • Enhanced Lid-lift assist feature (gas spring opens ≥45°)
    • Stand alone cabinet and streamlined design for minimized footprint (Chemical Storage)
    • X-PRO Workstation integrates stand alone cabinet with an upper exhaust enclosure for creating mini-environment (monitors and data logs ambient conditions)
    • Flexible configuration for enhanced developing and cleaning applications for fragile device structures
    • Stand-alone cabinet and streamlined design for minimized footprint
    • Full-color, 7-inch touch screen display
    • Drive system (indirect) with highest horsepower in its class

    Enhanced Process Applications*

    • Photoresist developing to produce high-aspect-ratio features for MEMS and advanced lithography (KrF/ArF)
    • Thick-film SU8 developing
    • Post-develop cleaning
    • Post-CMP cleaning
    • Photomask cleaning
    • Photoresist stripping
    • Metal lift-off (heated dispense optional)
    • Metal etching (heated dispense optional)

    Dispense Options

    Stream Dispense (Puddle)

    This option uses a standard automated center dispense option with pressure cans. It functions by “streaming” the developer and DI water onto the top of the substrate.

    The stream dispense option is:

    • Is very economical
    • Uses precision dispense valves with suckback control
    • Minimizes material usage
    • Is compatible with aqueous and solvent-based materials

    Stream DI Water/Solvent Rinse

    Brewer Science offers both topside and backside rinse options for cleaning applications. This dispense method is normally used in conjunction with a pressure dispense can or with a house DI water supply.

    Specifications

    Dimensions

    • Machine weight: 175 lb
    • Shipping weight: 450 lb
    • Cabinet dimensions: 35.75 in L × 29.0 in D × 59.50 in H

    Programmability

    • PC-controlled Windows® operating system)
    • System capable of controlling ProSys MicroPulse host software for ProSys’s high-end Megasonic system.
    • User-friendly touch screen interface and display
    • 250,000 spin process programs
    • Virtually an unlimited number of steps per spin program
    • 0.1-second resolution for step times (time: 0-9,999.9 s/step)
    • Spin speeds of 0-6,000 rpm (optional 4000 rpm and 3000 rpm for additional acceleration capabilities)
    • Spin speed accelerations:
      0-30,000 rpm/s unloaded
      0-23,000 rpm/s 300-mm substrate
      0-3,000 rpm/s 350 mm × 6 mm round recessed spin chuck
      0-300 rpm/s 14 in × 14 in × .250 in photomask recessed chuck
    • Connectivity: USB/Ethernet port for communications for uploading/downloading process parameters with offline firmware standard (offline recipe number and steps unlimited)
    • Simultaneous trigger of multiple (up to 16) automated dispense nozzles
    • Bidirectional speed control/oscillating chuck
    • Iteration software (recipe looping)
    • Dispense or component outputs: 50
    • Security: Password protection option at no charge
    • In-process, dynamic speed acceleration control

    Precision

    • Spin speed repeatability: < 0.2 rpm
    • Spin speed resolution: < 0.2 rpm
    • Substrate sizes: < 3 in to 450 mm round/14 in × 14 in square)

    Reliability

    • Indirect drive system protects the spin motor from accidental contact with process chemical and solvents.
    • Vacuum and lid interlock standard
    • Industry-leading reliability and uptime
    • 1-year full warranty on parts and labor
    • Free live technical phone support for the life of the product
    • Application process assistance (live) for the life of the product

    Bowl, Exhaust Hood, & Megasonic Transducer Design

    • All stainless steel construction
    • Drain and exhaust ports located in the bottom of bowl
    • Optional ETFE-coated spin bowl for material compatibility
    • Optional sapphire MegPie array for material compatibility
    • Optional Teflon®/polyethylene bowl non-disposable bowl liner
    • Optional exhaust hood (process chamber)
    • Optional fan filter unit (< Class 1 cleanliness inside process chamber)
    • Optional Teflon®/polyethylene splash ring
    • Optional nitrogen purge for an inert spin environment
    • Optional automatic N2 blow-off nozzle
    • Optional automatic drain separator (to separate aqueous and solvent-based fluids)

    Utilities

    • Power requirements: 200-240 Volts A/C, 2350 Watts, 12.0 AMP
    • Drain port: 1 in OD
    • Exhaust port: 1.5 in OD
    • Recommended utilities: Vacuum: 20 in Hg, Exhaust 20-50 cfm
    • Auto-Dispense requirements: N2 or CDA: 70 psi (15 lpm)
    • Maximum flow for DI water for developer spray and backside rinse (if hard-plumbed): 80 psi, regulator to be supplied by purchaser

    * - Patent-pending technology

    ×

Combination Tools

  • Cee® 200CBX precision coat-bake system
  • Cee® 200CBXPrecision Coat-Bake System

    Cee® 200CBX Precision Coat-Bake System

    The Brewer Science® Cee® 200CBX precision coat-bake system combines a track quality precision spin coater with a high uniformity bake plate, in an efficient space saving design.

    Benefits

    • Onboard Windows®-based PC control for enhanced interface capabilities and connectivity
    • New compact design for minimized footprint
    • Full-color, 7-inch touch screen display
    • Teflon® spin bowl for maximum chemical compatibility
    • Simultaneous operation and monitoring for both the coat and bake modules

    Download the Cee® Spin Chuck brochure

    Specifications

    Dimensions

    • 28" W x 19" D x 12" H (71.1 cm W x 48.3 cm D x 30.5 cm D)
    • Machine Weight: 165 lb (74.8 kg)
    • Shipping Weight: 250 lb (113.4 kg)

    Programmability

    • Controlled by onboard Windows®-based PC
    • Touch screen interface and display
    • Ethernet port for network connectivity and uploading/downloading process parameters
    • 250,000 process programs onboard
    • Virtually unlimited steps per program
    • 0.1-s resolution for step times with a range of
    • 0 to 9,999.9 s/step
    • Energy-saving capability (for predetermined temperature output control)
    • Security: password protection available at no charge
    • Three automated bake methods: contact, vacuum, proximity
    • Bake plate auto sizing for 3-inch, 100-, 125-, 150-, and 200-mm substrates
    • Temperature data recording
    • Optional electronic lift pins (replace N2 proximity for loading/unloading substrates from bake module). Program 1000 specific proximity heights above the surface in any sequence or combination. Height is programmed in 0.001-inch increments with an overall range of 0.000 to 0.750 inches.
    • Ramping capability optional (8 specific set points within a single bake recipe)
    • Spin speed: 0 to 6,000 rpm (12,000 rpm option at no charge; 16,000 rpm option available)
    • Spin speed acceleration:
      0 to 30,000 rpm/s unloaded
      0 to 23,000 rpm/s for 200-mm substrate
      0 to 3,000 rpm/s for 6" x 6" x 0.25" photomask recessed chuck
    • System capable of controlling third-party host software for high-end IDI/Cybor/Mykrolis positive displacement pumps
    • Simultaneous dual automated dispense capability
    • Bidirectional speed control/oscillating chuck
    • Iteration software (recipe looping)
    • Dispense or component outputs: 50
    • In-process/dynamic speed/acceleration control

    Precision

    • Spin speed repeatability: within < 0.2 rpm
    • Spin speed resolution: within < 0.2 rpm
    • Substrate sizes: < 1 cm to 200 mm round; 7" x 7" square)
    • Temperature resolution: ± 0.1°C
    • Temperature range: ambient to 300°C (400°C optional)
    • Temperature uniformity: 0.3% across working surface

    Reliability

    • Indirect drive system protects the spin motor from contact with process chemicals and solvents
    • Vacuum and lid interlock
    • Exceptional reliability and uptime
    • 1-year full warranty on parts and labor
    • Free remote technical support (phone, email, fax) for the life of the product
    • Application process assistance for life of the product
    • Bowl & Exhaust Hood Design
    • All stainless steel construction
    • Teflon® spin bowl for material compatibility
    • Integrated bowl ring to eliminate material migration
    • Optional stainless steel bowl (for all-stainless-steel construction)
    • Optional polyethylene bowl (educational package) available
    • Optional polyethylene liners available
    • Optional polyethylene/Teflon® splash ring
    • Closed and optional open lid designs for process flexibility
    • Drain and exhaust ports located in the bottom of bowl
    • Exhausted hood for removal of process chemicals
    • Optional nitrogen purge for inert spin/bake environment

    Utilities

    • Voltage ranges: 100, 110-125, 208-240 VAC, 50/60 Hz
    • Power requirements: 1793 watts (16 amps)
    • Drain Port: 0.75 inch OD
    • Exhaust Port: 1" OD
    • Vacuum: 20 to 25 inches Hg
    • Bowl Exhaust: 20 to 50 cfm
    • Bake Plate Exhaust: 1" OD; 5 to 10 cfm
    • Nitrogen or CDA (for automated dispenses): 70 psi
    ×
  • Cee® 200DBX precision develop-bake system
  • Cee® 200DBX Develop-Bake System

    Cee 200DBX Develop Bake System

    The Brewer Science® Cee® 200DBX precision develop-bake system combines a track-quality precision developer with a high-uniformity bake module (for post-exposure baking) in an efficient space saving design.

    Benefits

    • Spray, puddle, and stream systems available
    • Onboard Windows®-based PC control for enhanced
      interface capabilities and connectivity
    • Configurable for direct-angle continuous and/or side-angle spray puddle develop
    • New compact design for minimized footprint
    • Full-color, 7-inch touch screen display
    • Teflon® spin bowl for maximum chemical compatibility
    • Simultaneous operation and monitoring for both the coat and bake modules

    Developer Options

    Spray Dispense (Puddle/Direct)

    This option utilizes two spray nozzles to apply developer solution and deionized (DI) water. It uses an open UHMW lid with spray nozzles mounted either outside the wafer plane, spraying inward from the center of the wafer out (puddle spray), or directly over the substrate for continuous (direct) spray applications.

    • Uses 1-gallon pressure cans as reservoirs for developer solutions
    • Can use a maximum of four spray nozzles
    • Can be configured to accommodate up to four center puddle/direct dispenses

    Stream Dispense (Puddle)

    This option uses a standard automated dispense spinner and pressure cans. It functions by streaming developer and DI water onto the top of the substrate.

    • Very economical
    • Utilizes standard auto-dispense Lexan® lid
    • Uses suckback dispense valves
    • Minimizes material usage

    DI Water Rinse

    Both topside and backside DI water rinse options are available. This method of dispense is normally used in conjunction with a pressure can dispense or by using a house DI water supply.

    Specifications

    Programmability

    • Controlled by onboard Windows®-based PC
    • Touch screen interface and display
    • Ethernet port for network connectivity and uploading/downloading process parameters
    • 250,000 process recipe programs on board
    • Virtually unlimited number of user-defined recipe program steps
    • Energy-saving capability (for predetermined temperature output control)
    • Security: password protection available at no charge
    • Three automated bake methods: contact, vacuum, proximity
    • Bake plate auto sizing for 3-inch, 100-, 125-, 150-, and 200-mm substrates
    • Temperature data recording
    • Optional electronic lift pins (replace N2 proximity for loading/unloading substrates from bake module). Program 1000 specific proximity heights above the surface in any sequence or combination. Height is programmed in 0.001-inch increments with an overall range of 0.000 to 0.750 inches.
    • Ramping capability optional (8specific set points within a single bake recipe)
    • 0.1-second resolution for step times (maximum step time: 9,999.9 seconds)
    • Spin speed: 0 to 6,000 rpm (12,000 rpm option at no charge; 16,000 rpm option available)
    • Spin speed acceleration:
      0 to 30,000 rpm/s unloaded
      0 to 23,000 rpm/s with a 200-mm substrate
      0 to 3,000 rpm/s with a 6" x 6" x 0.25" photomask recessed chuck
    • System capable of controlling third-party host software for high-end IDI/Cybor/Mykrolis positive displacement pumps
    • Simultaneous dual automated dispense capability
    • Bidirectional speed control/oscillating chuck
    • Iteration software (recipe looping)
    • Dispense or component outputs: 50
    • In-process dynamic speed/acceleration control

    Precision

    • Spin speed repeatability: < 0.2 rpm
    • Spin speed resolution: < 0.2 rpm
    • Substrate sizes: < 1 cm to 200 mm round; 7 inch x 7 inch square
    • Temperature resolution: ± 0.1°C
    • Temperature range: ambient to 300°C (400°C optional)
    • Temperature uniformity: 0.3% across working surface

    Reliability

    • Indirect drive system protects the spin motor from contact with process chemicals and solvents
    • Vacuum and lid interlock
    • Industry-leading reliability and uptime
    • 1-year full warranty on parts and labor
    • Free remote technical support (phone, email, fax) for the life of the product
    • Application process assistance for life of the product

    Bowl & Exhaust Hood Design

    • Stainless steel construction
    • Teflon® spin bowl for material compatibility
    • Integrated bowl ring to eliminate material migration
    • Optional stainless steel bowl (for all-stainless-steel construction)
    • Optional polyethylene bowl (educational package) available
    • Optional polyethylene liners available
    • Optional polyethylene/Teflon® splash ring
    • Closed and open lid designs available for process flexibility
    • Drain and exhaust ports located in the bottom of bowl
    • Exhausted hood for removal of process chemicals
    • Optional nitrogen purge for an inert spin environment

    Utilities

    • Voltage ranges: 100, 110–125, 208– 240 VAC, 50/60 Hz
    • Power requirements: 1793 watts (16 amps)
    • Drain port: 3⁄4 inch OD
    • Exhaust port: 1 inch OD
    • Vacuum: 20 to 25 inches Hg
    • Bowl exhaust: 20 to 50 cfm
    • Bake plate exhaust: 1 inch OD; 5 to 10 cfm
    • Nitrogen or CDA (for automated dispenses): 70 psi
    • DI water for developer spray and backside rinse (if hard plumbed)

    Dimensions

    • 28" W x 19" D x 18" H (71.1 cm W x 48.3 cm D x 45.7 cm H)
    • Machine Weight: 165 lb (74.8 kg)
    • Shipping Weight: 250 lb (113.4 kg)
    ×

Wafer Debonders

  • Cee® 1300DB thermal slide debonder
  • Cee® 1300DB Benchtop Debonder

    The Brewer Science® Cee® 1300DB debonder enables high-temperature slide-off debonding of thinned wafers in a laboratory setting. This tool permits development engineers to complete the final step of thinned full wafer processing in a confidential developmental setting. Internal small-scale prototyping capability may be used to accelerate product development cycles and improve time to market for new ultrathin wafer technologies.

    Benefits

    • Design permits in-house debonding of fully processed, proprietary ultrathin device wafers
    • Data logging feature provides detailed process feedback and record keeping
    • PC control allows virtually unlimited log storage
    • Small footprint permits installation flexibility

    Utility Requirements & Dimensions

    • Exhaust: 30 cfm
    • Electrical: 208 V, single phase, 50/60 Hz, 6500 W
    • Nitrogen or CDA: 70 psi, 1 cfm
    • Dimensions: 66.5" L x 32.5" D x 52.5" H (170 cm L x 82 cm D x 130 cm H)
    • Weight: 187 kg

    Other Specifications

    • Platen Maximum Temperature: 300°C
    • Substrate Sizes (round): 3 in, 100 mm, 150 mm, 200 mm, 300 mm
    • Constant Force Mode: 0 to 100 lb
    • Constant Speed Mode: 0 to 100 mm/s
    • Logging: Force, distance, temperature

    Brewer Science® Thin-Wafer-Handling Solutions

    Brewer Science® solutions for thin wafer handling combine materials, processes, and equipment:

    Chemical Release Technology Slide Debonding Technology ZoneBOND® Technology (Beta Stage)
    • Room temperature debonding capability
    • Higher throughput capability
    • Compatible with 100- to 300-mm wafers
    ×
  • Cee® 1300CSX thermal slide debonder
  • Cee® 1300CSXThermal Slide Debonder

    Cee® 1300CSX benchtop debonder

    The Brewer Science® Cee® 1300CSX thermal slide debonder enables high-temperature slide-off debonding of thinned compound semiconductor materials (GaAs, GaN, InP, and SiC) in a laboratory setting. This tool allows engineers to complete the final step of thinned full wafer processing in a developmental setting. Internal small-scale prototyping capability may be used to accelerate product development cycles and improve time to market for new compound semiconductor applications (high-power RF, LED, and solar).

    Benefits

    • Design permits in-house debonding of fully processed, proprietary ultrathin device wafers
    • Enhanced data logging feature provides detailed process feedback and record keeping
    • PC control allows virtually unlimited log storage
    • Compact footprint permits installation flexibility

    Tool Features

    • Network connection hardware/software: RJ-45 Ethernet & USB port
    • Precision lower platen z-position control (closed-loop control / feedback): ± 5 μm accuracy
    • Specialized insertion and extraction end effectors with vacuum function (foot pedal control)
    • Visual and audible light tree alarm
    • Enhanced light curtain operation for seamless operation
    • Continue abort override operation for "super user"
    • Optional exhaust chamber sensor (PC-monitored)
    • Optional hinged rear and side access panels

    Utility Requirements & Dimensions

    • Exhaust: 20-30 cfm at 1" W.G. (4" OD exhaust duct)
    • Electrical: Voltage range 208-240 V, single phase, 50/60Hz, 3500 W
    • Power Requirements: 18 amps
    • Vacuum: -25" to -27" Hg (optimal vacuum: -27" Hg, (4.5 m3/h)
    • Nitrogen or CDA: 100 psi, 1 cfm
    • Optional Enclosure Purge: 3/8" push-to-connect (PTC tube) (20 psi)
    • Dimensions: 49" W × 39.5" D × 52.5" H (125 cm W × 100 cm D × 133 cm H)
    • Machine Weight: 415 lb (187 kg)
    • Shipping Weight: 1,280 lb

    Other Specifications

    • Platen Maximum Temperature: 300°C
    • Substrate Sizes (round): 2 in, 3 in, 100 mm, 125 mm, 150 mm, 200 mm
    • Constant Force Mode: 0 to 100 lb (with maximum velocity limit of 100 mm/s)
    • Logging: Critical force, distance, velocity, upper/lower platen vacuum, upper/lower platen temperature, z-position, and entire process duration time
    • Excess Force Sensing: Failsafe error recovery
    ×
  • ZoneBOND® separation tool
  • ZoneBOND® Separation Tool

    ZoneBOND separation tool

    The Brewer Science® ZoneBOND® separation tool is designed for separating wafers that have been bonded using the ZoneBOND® system for thin wafer processing. The ZoneBOND® system enables use of materials that broaden the thermal budget while maintaining very-low-stress room temperature debonding. ZoneBOND

    Benefits

    • Design that permits in-house debonding of fully processed proprietary ultrathin device wafers
    • Device wafer debonding on film frame
    • Onboard Windows®-based PC control for enhanced interface capabilities and connectivity
    • Compact design for minimized footprint
    • Full-color, 7-inch touch screen display
    • Enhanced force logging

    Processed Wafer

    Thinned wafer after being debonded with ZoneBOND™ separation tool
    Thinned wafer after being debonded with
    ZoneBOND® separation tool

    Brewer Science® Thin-Wafer Handling Solutions

    Brewer Science® solutions for thin wafer handling combines materials, processes and equipment:

    Chemical Release Technology Slide Debonding Technology ZoneBOND® Technology (Beta Stage)
    • Room temperature debonding capability
    • Higher throughput capability
    • Compatible with 100- to 300-mm wafers
    ×

Industry-Leading Features

The Brewer Science® Cee® X-series provides the user with fully programmable and user-friendly lab scale equipment with industry-leading features. These leading specifications include spin speed accuracy, repeatability, chemical compatibility, industry-leading temperature uniformity, and reliability. Collectively, these attributes are critical to ensuring optimal process performance over the long term.

Brewer Science has earned a repretation as the vendor of choice for those seeking R&D spin coaters, hot plates, and developers capable of production track–quality performance in a compact, flexible, and durable design. Brewer Science is the only benchtop equipment manufacturer to bring together the after-sale support and the design elements to make this high performance possible in a cost-effective product line.