CS ManTech

Compound Semiconductor Manufacturing 2016

See the next generation of temporary bonding equipment and thin wafer handling technology for SiC and compound semiconductor at the Brewer Science 2016 CS Mantech booth.

On display in the booth will be the new Cee® Apogee™ temporary bonding equipment suite designed with the DataStream™ Technology.

Ram Trichur and Matt Ziegler will be there to share the advancements in carrier technology for thinned wafer handling; and the new DataStream™ system that provides real-time process data and monitoring.

Ram Trichur
May 18th, 2016 · 11:40AM
6a.5 “Temporary Bonding for Backside Processing of 150-mm SiC Wafers”

Exhibitor’s Forum

Matt Ziegler
May 17th, 2016 · 5:00pm – 6:15pm
DataStreamTM Technology: The Next Generation of Tool Management

Booth Hours
May 16th · 6:00 PM – 9:00 PM
May 17th · 9:00 AM – 5:20 PM
May 18th · 8:30 AM – 11:00 AM