Wafer Debonders

Brewer Science® wafer debonder product line permits debonding of processed, proprietary ultrathin wafers. Development engineers can complete the final step for thin wafer processing in a confidential environment for:

  • High-temperature slide-off debonding of thinned III-V and compound semiconductor materials
  • Low-stress room temperature debonding

These precision tools are the bridge between low-stress room temperature debonding or thermal high temperature slide-off and thin wafer handling for low-volume prototype production. These tools, along with the Brewer Science® ZoneBOND® system for thin wafer handling, can accelerate your product development cycle and improve time to market for advanced thin wafer handling technologies.

Cee® 1300DB Benchtop Debonder

The Brewer Science® Cee® 1300DB debonder enables high-temperature slide-off debonding of thinned wafers in a laboratory setting. This tool permits development engineers to complete the final step of thinned full wafer processing in a confidential developmental setting. Internal small-scale prototyping capability may be used to accelerate product development cycles and improve time to market for new ultrathin wafer technologies.

Benefits

  • Design permits in-house debonding of fully processed, proprietary ultrathin device wafers
  • Data logging feature provides detailed process feedback and record keeping
  • PC control allows virtually unlimited log storage
  • Small footprint permits installation flexibility

Utility Requirements & Dimensions

  • Exhaust: 30 cfm
  • Electrical: 208 V, single phase, 50/60 Hz, 6500 W
  • Nitrogen or CDA: 70 psi, 1 cfm
  • Dimensions: 66.5" L x 32.5" D x 52.5" H (170 cm L x 82 cm D x 130 cm H)
  • Weight: 187 kg

Other Specifications

  • Platen Maximum Temperature: 300°C
  • Substrate Sizes (round): 3 in, 100 mm, 150 mm, 200 mm, 300 mm
  • Constant Force Mode: 0 to 100 lb
  • Constant Speed Mode: 0 to 100 mm/s
  • Logging: Force, distance, temperature

Brewer Science® Thin-Wafer-Handling Solutions

Brewer Science® solutions for thin wafer handling combine materials, processes, and equipment:

Chemical Release Technology Slide Debonding Technology ZoneBOND® Technology (Beta Stage)
  • Room temperature debonding capability
  • Higher throughput capability
  • Compatible with 100- to 300-mm wafers
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Cee® 1300CSXThermal Slide Debonder

Cee® 1300CSX benchtop debonder

The Brewer Science® Cee® 1300CSX thermal slide debonder enables high-temperature slide-off debonding of thinned compound semiconductor materials (GaAs, GaN, InP, and SiC) in a laboratory setting. This tool allows engineers to complete the final step of thinned full wafer processing in a developmental setting. Internal small-scale prototyping capability may be used to accelerate product development cycles and improve time to market for new compound semiconductor applications (high-power RF, LED, and solar).

Benefits

  • Design permits in-house debonding of fully processed, proprietary ultrathin device wafers
  • Enhanced data logging feature provides detailed process feedback and record keeping
  • PC control allows virtually unlimited log storage
  • Compact footprint permits installation flexibility

Tool Features

  • Network connection hardware/software: RJ-45 Ethernet & USB port
  • Precision lower platen z-position control (closed-loop control / feedback): ± 5 μm accuracy
  • Specialized insertion and extraction end effectors with vacuum function (foot pedal control)
  • Visual and audible light tree alarm
  • Enhanced light curtain operation for seamless operation
  • Continue abort override operation for "super user"
  • Optional exhaust chamber sensor (PC-monitored)
  • Optional hinged rear and side access panels

Utility Requirements & Dimensions

  • Exhaust: 20-30 cfm at 1" W.G. (4" OD exhaust duct)
  • Electrical: Voltage range 208-240 V, single phase, 50/60Hz, 3500 W
  • Power Requirements: 18 amps
  • Vacuum: -25" to -27" Hg (optimal vacuum: -27" Hg, (4.5 m3/h)
  • Nitrogen or CDA: 100 psi, 1 cfm
  • Optional Enclosure Purge: 3/8" push-to-connect (PTC tube) (20 psi)
  • Dimensions: 49" W × 39.5" D × 52.5" H (125 cm W × 100 cm D × 133 cm H)
  • Machine Weight: 415 lb (187 kg)
  • Shipping Weight: 1,280 lb

Other Specifications

  • Platen Maximum Temperature: 300°C
  • Substrate Sizes (round): 2 in, 3 in, 100 mm, 125 mm, 150 mm, 200 mm
  • Constant Force Mode: 0 to 100 lb (with maximum velocity limit of 100 mm/s)
  • Logging: Critical force, distance, velocity, upper/lower platen vacuum, upper/lower platen temperature, z-position, and entire process duration time
  • Excess Force Sensing: Failsafe error recovery
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ZoneBOND® Separation Tool

ZoneBOND separation tool

The Brewer Science® ZoneBOND® separation tool is designed for separating wafers that have been bonded using the ZoneBOND® system for thin wafer processing. The ZoneBOND® system enables use of materials that broaden the thermal budget while maintaining very-low-stress room temperature debonding. ZoneBOND

Benefits

  • Design that permits in-house debonding of fully processed proprietary ultrathin device wafers
  • Device wafer debonding on film frame
  • Onboard Windows®-based PC control for enhanced interface capabilities and connectivity
  • Compact design for minimized footprint
  • Full-color, 7-inch touch screen display
  • Enhanced force logging

Processed Wafer

Thinned wafer after being debonded with ZoneBOND™ separation tool
Thinned wafer after being debonded with
ZoneBOND® separation tool

Brewer Science® Thin-Wafer Handling Solutions

Brewer Science® solutions for thin wafer handling combines materials, processes and equipment:

Chemical Release Technology Slide Debonding Technology ZoneBOND® Technology (Beta Stage)
  • Room temperature debonding capability
  • Higher throughput capability
  • Compatible with 100- to 300-mm wafers
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