The Brewer Science^® Cee^® 200DBX precision develop-bake system combines a track-quality precision developer with a high-uniformity bake module (for post-exposure baking) in an efficient space saving design.

Benefits

• Spray, puddle, and stream systems available
• Onboard Windows^®-based PC control for enhanced
  interface capabilities and connectivity
• Configurable for direct-angle continuous and/or side-angle spray puddle develop
• New compact design for minimized footprint
• Full-color, 7-inch touch screen display
• Teflon^® spin bowl for maximum chemical compatibility
• Simultaneous operation and monitoring for both the coat and bake modules

Developer Options

Spray Dispense (Puddle/Direct)

This option utilizes two spray nozzles to apply developer solution and deionized (DI) water. It uses an open UHMW lid with spray nozzles mounted either outside the wafer plane, spraying inward from the center of the wafer out (puddle spray), or directly over the substrate for continuous (direct) spray applications.

• Uses 1-gallon pressure cans as reservoirs for developer solutions
• Can use a maximum of four spray nozzles
• Can be configured to accommodate up to four center puddle/direct dispenses

Stream Dispense (Puddle)

This option uses a standard automated dispense spinner and pressure cans. It functions by streaming developer and DI water onto the top of the substrate.

• Very economical
• Utilizes standard auto-dispense Lexan^® lid
• Uses suckback dispense valves
• Minimizes material usage

DI Water Rinse

Both topside and backside DI water rinse options are available. This method of dispense is normally used in conjunction with a pressure can dispense or by using a house DI water supply.

Specifications

Programmability

• Controlled by onboard Windows^®-based PC
• Touch screen interface and display
• Ethernet port for network connectivity and uploading/downloading process parameters
• 250,000 process recipe programs on board
• Virtually unlimited number of user-defined recipe program steps
• Energy-saving capability (for predetermined temperature output control)
• Security: password protection available at no charge
• Three automated bake methods: contact, vacuum, proximity
• Bake plate auto sizing for 3-inch, 100-, 125-, 150-, and 200-mm substrates
• Temperature data recording
• Optional electronic lift pins (replace N2 proximity for loading/unloading substrates from bake module). Program 1000 specific proximity heights above the surface in any sequence or combination. Height is programmed in 0.001-inch increments with an overall range of 0.000 to 0.750 inches.
• Ramping capability optional (8specific set points within a single bake recipe)
• 0.1-second resolution for step times (maximum step time: 9,999.9 seconds)
• Spin speed: 0 to 6,000 rpm (12,000 rpm option at no charge; 16,000 rpm option available)
• Spin speed acceleration:
  0 to 30,000 rpm/s unloaded
  0 to 23,000 rpm/s with a 200-mm substrate
  0 to 3,000 rpm/s with a 6" x 6" x 0.25" photomask recessed chuck
• System capable of controlling third-party host software for high-end IDI/Cybor/Mykrolis positive displacement pumps
• Simultaneous dual automated dispense capability
• Bidirectional speed control/oscillating chuck
• Iteration software (recipe looping)
• Dispense or component outputs: 50
• In-process dynamic speed/acceleration control

Precision

• Spin speed repeatability: < 0.2 rpm
• Spin speed resolution: < 0.2 rpm
• Substrate sizes: < 1 cm to 200 mm round; 7 inch x 7 inch square
• Temperature resolution: ± 0.1°C
• Temperature range: ambient to 300°C (400°C optional)
• Temperature uniformity: 0.3% across working surface

Reliability

• Indirect drive system protects the spin motor from contact with process chemicals and solvents
• Vacuum and lid interlock
• Industry-leading reliability and uptime
• 1-year full warranty on parts and labor
• Free remote technical support (phone, email, fax) for the life of the product
• Application process assistance for life of the product

Bowl & Exhaust Hood Design

• Stainless steel construction
• Teflon^® spin bowl for material compatibility
• Integrated bowl ring to eliminate material migration
• Optional stainless steel bowl (for all-stainless-steel construction)
• Optional polyethylene bowl (educational package) available
• Optional polyethylene liners available
• Optional polyethylene/Teflon^® splash ring
• Closed and open lid designs available for process flexibility
• Drain and exhaust ports located in the bottom of bowl
• Exhausted hood for removal of process chemicals
• Optional nitrogen purge for an inert spin environment

Utilities

• Voltage ranges: 100, 110–125, 208– 240 VAC, 50/60 Hz
• Power requirements: 1793 watts (16 amps)
• Drain port: 3⁄4 inch OD
• Exhaust port: 1 inch OD
• Vacuum: 20 to 25 inches Hg
• Bowl exhaust: 20 to 50 cfm
• Bake plate exhaust: 1 inch OD; 5 to 10 cfm
• Nitrogen or CDA (for automated dispenses): 70 psi
• DI water for developer spray and backside rinse (if hard plumbed)

Dimensions

• 28" W x 19" D x 18" H (71.1 cm W x 48.3 cm D x 45.7 cm H)
• Machine Weight: 165 lb (74.8 kg)
• Shipping Weight: 250 lb (113.4 kg)