Tony Flaim, Chief Technical Officer, Brewer Science Keynotes at The Advanced Packaging & System Integration Technology Symposium

April 17, 2017 – Wuxi, China

April 17, 2017 – Wuxi, China– Brewer Science invites you to join us April 21 for the Advanced Packaging & System Integration Technology Symposium in Wuxi, China. Organized by Yole Développement and the National Center for Advanced Packaging (NCAP China), this event will focus on the field of advanced packaging and include the newest developments in fan-out packaging, system in package, advanced substrates, 3D technology & embedded technologies, as well as MEMS & sensors packaging, radio frequency, and photonics.

Dr. Tony D. Flaim, Chief Technical Officer for Brewer Science, will be the keynote speaker on Friday, April 21, at the Advanced Packaging & System Integration Technology Symposium. Dr. Flaim will speak from 9:00 am to 9:45 am on, “The Evolution of Material & Process Strategies for Handling Wafer Level Packaging Substrates.”

Attendees are invited to reserve the date and make plans to hear Dr. Flaim’s presentation as he discusses the issues, challenges, and opportunities in the industry.

Learn more about Brewer Science at www.brewerscience.com, follow us on Twitter at @BrewerScience, like us on Facebook at http://www.facebook.com/BrewerScience, and subscribe to our blog at http://blog.brewerscience.com .

About The Speaker
Tony D. Flaim received a B.A. in Pre-Medicine from the University of Missouri – Columbia in 1974 and a Ph.D. in Physical Chemistry from the University of Missouri – Rolla in 1983. After working as a Senior Research Chemist at Dow Chemical Corporation, he joined Brewer Science as a Senior Chemist in 1985. Since that time, he has played a prominent role in the development of the company’s innovative product portfolio that includes bottom anti-reflective coatings, polyimide lift-off layers, and wafer protection coatings. Most recently, Dr. Flaim has directed the development of temporary wafer bonding materials and dielectric coatings for the production of advanced semiconductor packages and 2.5-D and 3-D integrated devices. He has served on the senior management team of Brewer Science since 2004 and was named Chief Technical Officer in early 2008. Dr. Flaim holds more than 25 patents on microelectronic and optoelectronic materials and has authored more than 20 related publications.

About Brewer Science
Brewer Science is a global technology leader in developing and manufacturing innovative materials and processes for the fabrication of semiconductors and microelectronic devices. With its headquarters in Rolla, Missouri, Brewer Science supports customers throughout the world with a service and distribution network in North America, Europe, and Asia. We’re creating technology that moves the world. Learn more at http://www.brewerscience.com.

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For more information, contact:
Name: Loretta Wallis
Title: Corporate Relations Manager
Brewer Science
Tel: (US) +1.573.364.0300
Email: mwallis@brewerscience.com