07/14/2008
Improving services for the customer: Rite Track and Brewer Science form collaborative partnership
Brewer Science Releases a High-Temperature Ultrathin Wafer Handling Solution, WaferBOND™ HT-10.10 Coating
Brewer Science, Inc., announces the release of its second generation of spin-on polymeric temporary wafer bonding materials with superior bonded pair thermal stability. The Brewer Science WaferBOND™ HT-10.10 material bonds a device wafer to a temporary carrier to allow thinning and subsequent
