Advanced Packaging FAQs

Answers to frequently asked questions from our Advanced Packaging Team

What type of equipment is required for applying your bonding materials?

Brewer Science bonding materials are designed for use with standard spin-coating equipment. Brewer Science offers a line of benchtop spin coaters for low-volume and developmental applications.

What height of topography can your bonding materials cover?

Our wafer bonding materials can be processed to cover topography up to 80 µm. For higher topography, please consult your Brewer Science Account Manager or submit a request for information.

What is the maximum temperature the bonded wafer can withstand?

We provide a maximum temperature range for each bonding material. We also provide a decomposition temperature for each bonding material.

In general, we offer WaferBOND^® HT-10.10 material with a rated temperature up to 220°C and have materials in development targeted for temperatures up to 280°C. However, the maximum temperature that the "bond" can withstand depends on several factors such as the power setting used in a PECVD step, duration of the high-temperature process step, stress built up in the wafer due to metal layers or CTE mismatches between different deposited layers, etc.

What processing chemicals can the bonded pair withstand?

Please refer to the specific bonding material data sheet.

How is the bonding material removed after demounting?

The bonding material is thermoplastic in nature and therefore still soluble in casting solvents or their blends. The bonding material is removed by dissolution in a solvent-based remover supplied by Brewer Science. Standard spin-coating equipment is used for the cleaning step.