Wafer-level packaging (WLP) is commonly used for packaging of MEMS and LED devices as it offers advantages in cost, yield, and reliability. In a WLP scheme, MEMS structures or LED die are encapsulated between bonded wafers, one of which has cavities that are fabricated most commonly by bulk micromachining.
Bulk micromachining is a process typically used in applications such as micromachinery or microelectromechanical systems (MEMS).
Unlike surface micromachining, which uses a succession of thin film deposition and selective etching steps, bulk micromachining defines structures by selectively etching inside a substrate. Whereas surface micromachining creates structures on top of a substrate, bulk micromachining produces structures inside a substrate.
Equipment: Brewer Science® Processing Equipment