Planarization - Trench Fill
3-D fabrication and packaging process flows may include steps that necessitate coating resists and other materials over deep and wide features such as trenches. These steps typically result in low yield and low throughput as several layers of the resist are needed to fill the trenches prior to lithography. Brewer Science offers planarization technology, including materials and processes to planarize the deep features.
Brewer Science products provide a planar surface when coated over high-aspect-ratio structures.
Trench prior to coating Coating after develop