Thermal Slide Debonding
During slide debonding, the device wafer is debonded from the rigid carrier using a thermomechanical process. The bonded wafer is heated to a specified temperature at which the adhesive is softened, followed by mechanical sliding of the carrier from the ultrathin wafer.
Brewer Science® WaferBOND® HT materials enable the creation and backside processing of ultrathin wafers by providing:
- A stable platform for wafer thinning and backside processing
- Excellent uniformity
- Protection from harsh process chemicals
- High throughput and yield