Compound Semiconductor Manufacturing
Brewer Science designs and manufactures a broad range of specialty materials and low-volume production equipment that play critical roles in multiple processes used in the creation of compound semiconductor devices. Our industry-leading expertise in process application and thin wafer handling can help you to optimize a variety of processes to meet your development and production needs. Brewer Science has acquired this expertise by creating innovative breakthroughs in materials, equipment, and process integration for over three decades.
Compound Semiconductor Manufacturing Processes Enabled by Brewer Science
Brewer Science thin wafer handling equipment enables:
- High-temperature slide-off debonding of thinned compound semiconductor substrates
- Low-stress room temperature debonding
Brewer Science equipment is compatible with any substrate type and size.
Examples of the most commonly used substrates:
|3″ to 150 mm||3″ to 150 mm||3″ to 150 mm||3″ to 150 mm|
Brewer Science tools for compound semiconductor applications are the benchmark for low-volume or prototype production.
Spin-applied materials that level the surfaces of processed wafers