LED FAQs

Answers to frequently asked questions from our LED Team

What is the minimum resolution for ProTEK^® PSB material?

Using a good photolithography process, we can resolve feature sizes as small as 5 µm using ProTEK^® PSB-23 coating. Thinner formulations using ProTEK^® PSB-15 coating can help to resolve features smaller than 5 µm.

Can ProTEK^® PSB coating be removed using a solvent?

ProTEK^® PSB coating is a negative-acting, crosslinked system. It is removed using a plasma ash process or a Nano-Strip^®-based removal chemistry. (Nano-Strip® is a registered trademark of Cyantek Corporation.)

What are the refractive indices of your optical coatings?

Using our standard baking processes, OptiNDEX^™ A54 coating has a refractive index of 1.95 to 2.15 in the visible spectrum, and OptiNDEX^™ D1 coating has a refractive index between 1.7 and 1.8.

What is the standard thickness of ProTEK^® PSB-23 coating for etch protection applications?

Our recommended spin-coating process produces a film that is ~ 5 µm thick.

What is the maximum process temperature the WaferBOND^® bonding material can withstand during wafer processing?

Our commercial products, WaferBOND^® HT-10.10 material (for thermal slide debonding) and WaferBOND^® CR-200 (for solvent-based debonding), are stable up to 220°C. If you use higher process temperatures, we have pre-commercial products that are being evaluated in fabs around the world that can withstand higher temperatures. Please contact us and we will provide further information.