Answers to frequently asked questions from our LED Team
What is the minimum resolution for ProTEK® PSB material?
Using a good photolithography process, we can resolve feature sizes as small as 5 µm using ProTEK® PSB-23 coating. Thinner formulations using ProTEK® PSB-15 coating can help to resolve features smaller than 5 µm.
Can ProTEK® PSB coating be removed using a solvent?
ProTEK® PSB coating is a negative-acting, crosslinked system. It is removed using a plasma ash process or a Nano-Strip®-based removal chemistry. (Nano-Strip® is a registered trademark of Cyantek Corporation.)
What are the refractive indices of your optical coatings?
Using our standard baking processes, OptiNDEX™ A54 coating has a refractive index of 1.95 to 2.15 in the visible spectrum, and OptiNDEX™ D1 coating has a refractive index between 1.7 and 1.8.
What is the standard thickness of ProTEK® PSB-23 coating for etch protection applications?
Our recommended spin-coating process produces a film that is ~ 5 µm thick.
What is the maximum process temperature the WaferBOND® bonding material can withstand during wafer processing?
Our commercial products, WaferBOND® HT-10.10 material (for thermal slide debonding) and WaferBOND® CR-200 (for solvent-based debonding), are stable up to 220°C. If you use higher process temperatures, we have pre-commercial products that are being evaluated in fabs around the world that can withstand higher temperatures. Please contact us and we will provide further information.