Thin Wafer Handling for LEDs
Brewer Science provides materials, processes, and equipment to support bonding and debonding of wafers or die to carrier substrates, enabling layer transfer and thin wafer handling. Brewer Science provides solutions that support these processes:
- Wafer thinning
- Layer transfer for laser lift-off (LLO)
- Through-wafer via creation for interconnects
Brewer Science® temporary bonding materials provide excellent thermal stability at temperatures up to 220°C.