WaferBOND Product Set

Aug 6, 2006

Brewer Science's WaferBOND™ product set combines a new spin on polymer and a remover and is specially designed for temporary wafer bonding applications. Features include: – Single coat over 10µm
– Excellent resistance to common process chemicals and solvents
– Process capabilities up to 180°C To learn more about this new product set, please view a product presentation or we welcome you to  contact us.