New Ultrathin Wafer Handling Solution for the Microelectronics Industry, WaferBOND HT-250

Jul 17, 2007

Brewer Science announces successful commercialization of the first generation of yield-improving, polymeric, spin-on WaferBOND™ HT-250 coating. Its use will extend to high-volume device manufacturing the ability to thin wafers and subequently process them.  Now higher temperature, advanced packaging processes will be feasible for flash memory, image sensors, and power device manufacturing.  WaferBOND™ HT-250 coating allows your device substrate to be temporarily bonded to a carrier substrate for thinning and follow-on processes, such as deposition, lithography, etching, plating, annealing and cleaning, to generate through-hole via structures and redistribution layers on the thin device wafer.  This achievement is key to enable 3-D stacking of devices, which is needed to produce multifunctional devices having improved performance and compact footprints.

Advanced packaging will benefit from the WaferBOND™ HT-250 systems by:
  • Increased process range and capability
    • High-temperature processing capability ≥200*C
    • Broad chemical resistance
    • Broad process capability
  • Increased yield
    • Low total thickness variation (TTV): <0.5µm at 10nm
    • Planarization of device structures to improve TTV
    • High bond uniformity
    • Excellent edge protection
  • Increased throughput
    • Fast slide-off debonding cycle (<5 minutes)
    • Easy polar solvent strip clean-up
The strength of this material and equipment system is that it represents is a total solution for our customers' ultrathin wafer handling. The advanced polymeric coatings expertise of Brewer Science aligned with the industry-standard EVG® bonding equipment have created this successful system that resolves one of the semiconductor industry's leading roadblocks for advance packaging.