Brewer Science provides continuous improvement of 3D packaging solutions

Aug 17, 2009

Behind Brewer Science's wafer bonding work
See what Karen Twillmann and Dan Wallace have to say about Brewer Science's focus on equipment, material, and process solutions for 3D packaging in the August 2009 edition of Solid State Technology.

Blog: Perspectives from the Leading Edge
Steve Dwyer of EVG North America tells Dr. Phil Garrou that Brewer Science materials "simply are the best." Read more of the blog interview posted at Semiconductor International's web site.