Brewer Science, Inc., a major innovator of high-technology solutions for the semiconductor and microelectronics markets, is pleased to announce that two patents have been awarded by the U.S. Patent and Trademark Office:

• U.S. patent #7,602,066 B2 establishes a new method for filling structures in the formation of via-first dual damascene interconnects

• U.S. patent #7,601,483 B2 is a novel anti-reflective coating using vinyl ether crosslinkers.

“These patents follow Brewer Science’s commitment to develop materials that are innovative,” states Carlton Washburn, Product Manager and inventor.  “Wet-developable gap-fill and bottom anti-reflective coatings (DBARCs) are unique in that they are resistant to solvent but soluble in developer.”

With Brewer Science’s new method of filling structures for forming via-first dual damascene interconnects, superior lithography and etch transfer performance may be achieved during the formation of dual damascene structures.

In the manufacture of microelectronic devices, anti-reflective coatings using vinyl ether crosslinkers provide new wet developable compositions that reduce processing steps by the elimination of the dry etch step, conserving precious resources.

“These new technologies underlie our company’s commitment to bring cutting-edge and cost-effective solutions to the forefront of the semiconductor industry,” says Chris Cox, Product Manager and inventor.  “With these new technologies, Brewer Science will ensure our customers’ success for current and future technology nodes.”

The real success for Brewer Science is enabling advancements in future technologies for our customers.