Brewer Science
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Careers
MSDS
Environment
Site Map
2:
Markets
2.1:
Semiconductor
2.3:
MEMS, Sensors & Displays
2.3.1:
Micromachining
2.3.2:
Surface Energy Modification
2.3.3:
Leveling Extreme Topography
2.3.4:
Thin Wafer Handling
2.3.5:
MEMS FAQs
2.4:
Advanced Packaging
2.4.1:
Thin Wafer Handling
2.4.1.1:
ZoneBOND™ Process
2.4.1.2:
Chemical Debonding
2.4.1.3:
Thermal Slide Debonding
2.4.2:
Planarization - Trench Fill
2.4.3:
Surface Protection
2.4.5:
Micromachining
2.4.6:
Advanced Packaging FAQs
2.5:
LED & Energy
2.5.1:
Light Extraction
2.5.2:
Wet Etch Protection
2.5.3:
Physical Protection
2.5.4:
Metal Deposition & Alternatives
2.5.5:
Thin Wafer Handling
2.5.6:
LED FAQs
2.6:
Semiconductor Equipment
4:
Products
4.1:
Anti-Reflective Coatings
4.1.1:
Dry Etch ARC® Coatings
4.1.1.1:
193-nm (ArF) Products
4.1.1.2:
248-nm (KrF) Products
4.1.1.3:
365-nm (i-Line) Products
4.1.1.3.1:
ARC i-CON Coating
4.1.1.3.2:
XHRiC Coating
4.1.1.3.3:
WiDE®-C Coating
4.1.1.3.4:
GenARC® 365 Coating
4.1.2:
Developer-Soluble BARC
4.1.3:
Ancilliary Products
4.1.7:
PFOS-Free Program
4.1.8:
FAQs
4.2:
OptiStack® Systems
4.2.1:
OptiStack® Simulation
4.3:
Lift-Off Materials
4.4:
EUV Assist Layers
4.5:
Gap-Fill Systems
4.6:
Protective Coatings
4.6.1:
Lift-Off Materials
4.6.2:
ProTEK® SR Coating
4.6.3:
ProTEK® B3 Coatings
4.6.4:
ProTEK® PSB Coating
4.6.5:
EdgeWRAP® System
4.6.6:
FAQs
4.9:
Temporary Bonding
4.9.1:
ZoneBOND™ Process
4.9.2:
WaferBOND® CR-200
4.9.3:
WaferBOND® HT-10.10
4.10:
Processing Equipment
4.10.1:
Spin Coaters
4.10.1.1:
Spin Coater (200X)
4.10.1.3:
Heavy-Duty-Drive Spin Coater (300X)
4.10.2:
Bake Plates
4.10.2.1:
Bake Plate (1300X)
4.10.2.2:
300-mm Bake Plate (10)
4.10.2.3:
450-mm Bake Plate (11)
4.10.3:
Developers
4.10.3.1:
Developer (200XD)
4.10.3.2:
Developer (300XD)
4.10.3.3:
Megasonic Developer / Cleaner (300MXD)
4.10.4:
Combination Tools
4.10.4.1:
Develop-Bake System (200DBX)
4.10.4.2:
Coat-Bake System (200CBX)
4.10.5:
Flange Mount Systems
4.10.6:
Wafer Debonders
4.10.6.1:
Slide Debonder (1300DB)
4.10.6.2:
ZoneBOND™ Separation Tool
4.10.6.3:
Slide Debonder (1300CSX)
4.10.7:
EdgeWRAP® System
4.10.10:
Automated Bottle Filling System
4.10.11:
Processing Theory
4.10.14:
Equipment FAQs
4.10.16:
Testimonials
4.11:
Carbon Nanotube Solutions
4.12:
High-Refractive Index
4.15:
Planarization Solutions
4.16:
Etch Protection Solutions
4.17:
Alignment Coatings
4.18:
FAQs
4.18.1:
Advanced Packaging FAQs
4.18.2:
Lithography FAQs
4.18.3:
MEMS FAQs
4.18.4:
Equipment FAQs
4.18.5:
LED FAQs
6:
Research
6.1:
Publications
6.2:
Patents
6.3:
Processing Theory
6.3.1:
Bake Plate Overview
6.3.2:
Bake Plate Process Theory
6.3.3:
Spin Coater Theory
6.3.4:
Processing Equipment
8:
Company
8.3:
Vision
8.7:
Global Operations
8.7.1:
North America
8.7.2:
Asia
8.7.3:
Europe
8.8:
Quality
8.8.1:
Customer Satisfaction
8.8.2:
Customer Quality Report Portal
8.8.3:
Registrations
8.11:
Testimonials
8.13:
Media
9:
Contact Us
9.4:
Global Operations
27:
Blog
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News Articles
Events
News
News
IMAPS Microelectronics Symposium
Oct. 31"“Nov. 4, 2010 Research Triangle, NC
Brewer Science Papers
Filling and Planarizing Deep Trenches with Polymer for Through-Silicon Via Technology
Advanced Thin Wafer Support Processes for Temporary Wafer Bonding
Conference Details