Is 3D packaging where it needs to be?

Sep 15, 2011

More than a hundred attendees gathered at a Suss MicroTec workshop at this year's SEMICON West (“3D Integration: Are we there yet?”) to hear technical experts from around the globe to present updates on the status of 3D IC packaging.

Rama PuligaddaRama Puligadda, Division Manager for advanced materials R&D at Brewer Science, discusses the ZoneBOND™ room-temperature debonding process.

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