Garching/Munich, GERMANY / ROLLA, MO, USA, December 05, 2011 – Brewer Science, Inc., the inventor of ZoneBOND™ technology and world leading expert in materials and processes for thin wafer handling, and SUSS MicroTec, a leading supplier of equipment, are joining forces in commercializing ZoneBOND™ technology for thin wafer handling.
SUSS MicroTec, market leader in room temperature debonding process equipment, is now offering the Brewer Science ZoneBOND™ process on the XBC300 and XBS300 platforms, targeted for high volume bonding and debonding of 200/300mm wafers using silicon or glass carriers.
Brewer Science offers products specifically designed for the successful implementation of the ZoneBOND™ process including materials for carrier preparation, adhesives, removers, as well as small scale debonding equipment.
ZoneBOND™ technology is a break-through solution for wafer handling that provides excellent total thickness variation (TTV) control, high-temperature stability, and low-stress debonding. Customers will benefit through higher yield at debonding, higher throughput, and lower cost of ownership.
This joint effort combines both companies’ expertise to provide a complete material, equipment and process solution, optimized for each individual customer’s process needs.
Brewer Science is a global technology leader in creating, developing, and manufacturing specialty materials, equipment, and process solutions for applications in semiconductors, advanced packaging/3-D ICs, MEMS, sensors, displays, LEDs, and printed electronics. The company's 30 years of in-depth knowledge and expertise in materials science, chemistry, physics, optics, modeling, and process integration distinguish it from all other material suppliers worldwide. For more information, please visit www.brewerscience.com.
SUSS MicroTec (listed on TecDAX of Deutsche Börse AG) is a leading supplier of equipment and process solutions for microstructuring in the semiconductor industry and related markets. In close cooperation with research institutes and industry partners SUSS MicroTec contributes to the advancement of next-generation technologies such as 3-D integration and nanoimprint lithography as well as key processes for MEMS and LED manufacturing. With a global infrastructure for applications and service, SUSS MicroTec supports more than 8,000 installed systems worldwide. SUSS MicroTec is headquartered in Garching near Munich, Germany. For more information, please visit www.suss.com.
Director, Advanced Packaging
Brewer Science, Inc.
Tel: (US) +1.573.364.0300, Ext: 1346
Head of IR and PR
SÜSS MicroTec AG
Tel: +49 89 32 007 161