Brewer Science introduces thin wafer handling systems for compound semiconductor device processing
April 17, 2012 – Brewer Science, Inc., introduces new wafer processing equipment designed for thin wafer separation and post-debonding cleaning, steps that are critical for ultrasensitive compound semiconductor (CS) device processing. These latest equipment designs enable thin wafer handling technologies that can broaden your process window and lower your total cost of ownership by reducing yield loss and increasing throughput.
“Brewer Science® Cee® lab-scale processing equipment offers track-quality precision and is suitable for low-volume prototype processing that enables transfer to high-volume manufacturing,” says Wayne Farrar, Director of Equipment. “No other company is as uniquely positioned as Brewer Science to offer complete solutions for your thin wafer handling needs. With our temporary bonding materials and lab-scale equipment, we bring a breadth and depth of process experience that is unequaled by any other company.”
The following are the new semi-automatic thin wafer handling tools manufactured by Brewer Science for CS processing applications:
- Cee® 1300CSX thermal debonder enables high-temperature slide-off debonding of thinned III-V and CS materials (GaAs, GaN, InP, and SiC) in a confidential laboratory setting.
- ZoneBOND™ separation tool has been enhanced with compliant seal clamps and fail-safe abort hardware to accommodate thinned III-V and CS materials. The latest generation provides superior precision control for debonding materials that are highly sensitive to mechanical and thermal shock, flexibility for sizes ranging from 2 inches to 300 mm, and very-low-stress room temperature debonding.
- Cee® 300MXD megasonic cleaning system applies uniform acoustic energy to spinning substrates to gently remove adhesive residues and contaminants without damaging fragile device structures.
Visit Brewer Science at CS MANTECH, booth 47.
About Brewer Science
Brewer Science is a global technology leader in creating, developing, and manufacturing specialty materials, equipment, and process solutions for applications in semiconductors, compound semiconductors, advanced packaging/3-D ICs, MEMS, sensors, displays, LEDs, and printed electronics. The company's 30 years of in-depth knowledge and expertise in materials science, chemistry, physics, optics, modeling, and process integration distinguish it from all other material and equipment suppliers worldwide. Learn more: Click Here
If you would like more information about this topic, please contact:
Name: Wayne Farrar
Title: Business Pipeline Leader, Lab Equipment
Tel: (US) +1.573.364.0300, Ext: 1155