Brewer Science aims to revolutionise wafer bonding

Jul 10, 2013

Tony FlaimTony Flaim, Chief Technical Officer at Brewer Science, explains to Dr. Su Westwater at Silicon Semiconductor how ZoneBOND® technology enables advanced TSV processing and ultrathin layer handling. The article appears in Silicon Semiconductor, Volume 35, Issue 2, 2013 and entitled Brewer Science aims to revolutionize wafer bonding.

Download the article here

Download the full issue of Silicon Semiconductor here.

Learn more about ZoneBOND® thin wafer handling technology here.