December 5 - 6, 2013
Brewer Science is a sponsor of The International Conference on Wafer Bonding - Waferbond '13. The conference will be held at the KTH Royal Institute of Technology, December 5-6, 2013, in Stockholm, Sweden.
Anne Jourdain, IMEC, will present a joint paper with Brewer Science:
Temporary bonding for high topography: spin-on versus dry bonding film
Session 6: Temporary and Adhesive Wafer Bonding
Friday, December 6th, 11:50 a.m.