Upcoming Events

May
Computex
May 31 - Jun 4, 2016 · Taipei, Taiwan

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ECTC
May 31 - Jun 1, 2016 · Las Vegas, Nevada

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Presentation
Friday, June 3rd · 2:20PM
Session 36: 3D materials & Processing
Extremely Low-Force Debonding of Thinned CMOS Substrate by Laser Release of a Temporary Bonding Material"
Alain Phommahaxay, Goedele Potoms, Greet Verbinnen, Erik Sleeckx, Gerald Beyer, and Eric Beyne – IMEC; Alice Guerrero, Dongshun Bai, Xiao Liu, Kim Yess, and Kim Arnold – Brewer Science Inc.; Walter Spiess, Tim Griesbach, Thomas Rapps, and Stefan Lutter – SÜSS MicroTec Lithography GmbH

Program Session - Co-Chair
Materials & Processing
Room: Mont-Royal 1
Thursday, June 2nd · 8:00AM - 11:40AM
Kwang-Lung Lin – National Cheng Kung University
Kimberly Yess – Brewer Science



July
SEMICON West
Jul 12 - 14, 2016 · San Francisco, CA

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