Experience the difference with Brewer Science's revolutionizing technologies. We offer an extensive range of products, from lithography materials to equipment, that impact our everyday lives.
The Brewer Science universal spin chuck base offers the unique ability to seamlessly switch among chuck sizes ranging from 1/8" to 4" in diameter.
Directed self-assembly (DSA) is an exciting new technology that uses specially designed block copolymers to form IC patterns on a molecular scale.
BrewerBOND® 220 temporary wafer bonding material is an organic coating that enables back-end-of-line (BEOL) processing of ultrathin wafers using standard semiconductor equipment.
The Cee® ApogeeTM precision spin coater delivers track-quality performance with revolutionary interface capabilities.
The Cee® Apogee™ bake plate features a revolutionary intuitive interface, a space-saving design, and track-quality thermal accuracy and uniformity.
Now you can have all the amenities of a controlled clean room environment at your fingertips wherever you need it. We have created the ultimate stand-alone, completely customizable system that will change the way you work.
OptiStack® multilayer systems are our flagship lithography technology, and are used for leading-edge high volume IC manufacturing.
The Cee® 200DBX precision develop-bake system combines a track-quality precision developer with a high-uniformity bake module (for post-exposure baking) in an efficient space saving design.
ProTEK® PSB coating is a spin-on replacement for silicon nitride or silicon oxide wet etch masks
ProTEK® B3 coatings thin films are spin-applied polymeric coating systems that provide temporary wet-etch protection for CMOS MEMS circuitry during alkaline or acid etches.
ARC® anti-reflective coatings are the industry benchmark for reflection control and light absorption during photolithography.
Temporary wafer bonding release material for mechanical debonding applications
BrewerBOND® 701 material is suitable for all production environments due to its high throughput and no-stress separation.
WaferBOND® HT-10.10 temporary bonding material enables back-end-of-line (BEOL) processing of ultrathin wafers with standard semiconductor equipment
WaferBOND® CR-200 temporary bonding material enables back-end- of-line processing of ultrathin wafers with standard semiconductor equipment
BrewerBOND® 305 temporary wafer bonding material is an organic coating that enables back-end-of-line (BEOL) processing of ultrathin wafers using standard semiconductor equipment.
InFlect™ flex sensors utilize our revolutionary carbon-based nanotechnology to deliver a highly sensitive and real-time response to varying angles of deflection.
With its revolutionary carbon-based sensor design, our InFlect™ moisture sensor enables detection of small changes in relative humidity at millisecond speeds.
InFlect™ thermistors are among the fastest on the market, are highly accurate, and can operate at extremely low power, due to a revolutionary carbon-based nanotechnology.
The Cee® Model 11 bake plate provides the user with the utmost in thermal accuracy and uniformity.
The Cee® Model 10 bake plate provides the user with repeatable thermal performance in a robust system design for years of reliable operation.
The Cee® 200XD puddle and spray developer delivers track-quality performance, and chemical and process flexibility, in a space saving design.
The Cee® 300X heavy-duty-drive spin coater combines an intuitive Windows®-based operating system, accurate spin speed control, and a high horsepower drive.
The Cee® 300MXD megasonic developer & cleaning system applies uniform acoustic energy to spinning substrates to resolve high-density features.
The Cee® 300XD spray/puddle developer combines accurate spin speed control, and a high horsepower drive for aggressive acceleration.