Thermal Slide Debonding

During slide debonding, the device wafer is debonded from the rigid carrier using a thermomechanical process. The bonded wafer is heated to a specified temperature at which the adhesive is softened, followed by mechanical sliding of the carrier from the ultrathin wafer.

Brewer Science® WaferBOND® HT materials enable the creation and backside processing of ultrathin wafers by providing:

  • A stable platform for wafer thinning and backside processing
  • Excellent uniformity
  • Protection from harsh process chemicals
  • High throughput and yield

Materials: WaferBOND® HT 10.10 material
Equipment: Cee® 1300DB semiautomatic debonder

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