DUV 252 coating improves wafer throughput and conserves etch budget for a wide range of 248-nm lithography layers

130 nm L/S 1:1 features

• Increase tool uptime due to ultra low outgassing
• Increase flexibility in photoresist selections
• Apply in both FEOL and BEOL processes
• Achieve full via fill

Brewer Science DUV 252 BARC is a partial or full via-fill material used in the dual damascene process. This BARC material is designed to produce extremely low amounts of sublimates during the BARC bake step. A cleaner bake equals improved wafer yield by reducing defectivity and decreasing downtime for baking unit preventive maintenance.

Less than 2% reflectivity is achieved at first and second minima thicknesses by the light-absorbing ability of DUV 252 material. This excellent reflectivity control, combined with the planarizing characteristic of DUV 252 material, provides better control of resist thickness over topography. DUV 252 material is compatible with ESCAP DUV photoresists.

Contact Brewer Science

For more information, fill out an inquiry form or call 573.364.0300 (US) to talk directly with a technical representative. Brewer Science welcomes the opportunity to provide quality solutions for your specific applications.