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ARC i-CON® Conformal BARC for i-Line Lithography

ARC i-CON® coating conserves etch budget and offers coverage over high topography

The ARC i-CON® series of anti-reflective coatings have been specifically designed for superior coverage over high topography. The materials have excellent optical properties for the control of substrate reflectivity and the enhancement of CD resolution and control. ARC i-CON® can be used to achieve feature sizes of < 0.25µm. ARC i-CON's formulation combines the features of high conformality and faster etch rates. It has about a 30% faster etch rate than most advanced i-line photoresists.

Features:

  • Reflectance on Poly Silicon with 70-nm coating: < 0.5%
  • 15°C bake range (185 to 200°C)
  • 300- to 350-nm resolution nodes
  • 90% Conformality on 5KA and 7KA topography

1:2 lines and spaces
1:2 lines and spaces
Conformality: 76%
Step Coverage: 210 Å

1:1 lines and spaces
1:1 lines and spaces
Conformality: 72%
Step Coverage: 320 Å

1:1 lines and spaces
1:1 lines and spaces
0.35-µm feature

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