WiDE^®-B coating eliminates the BARC open etch step in i-line lithography

Bake Temperature

182°C

190°C

WiDE^®-B was developed as a wet developable i-line bottom anti-reflective coating that eliminates the need for a BARC etch step. The extended bake latitude and advanced optical characteristics of the WiDE^® series allow use of a wet develop process in the sub half micron region. WiDE^® anti-reflective coatings minimize CD variation by elimination of standing waves and reflective notching. This material can also be used for dry etch systems with excellent results. WiDE^® has been successfully used as a sacrificial layer for lift-off applications.

Features:

• Compatible with leading i-line resists
• Sub 0.5µm wet patterning capable
• High absorbance allows less than 0.01µm variations over 1800Å topography
• Useful as a sacrificial layer in lift off applications
• Wet developable – no impact on etch tool or cycle time
• 10°C bake temperature range for 0.35µm geometry
• Able to perform as a dry etch BARC as well.

All ARC^® products are PFOS Free, for your health and the safety of the environment.