WiDE®-B Wet Developable i-Line Anti-Reflective Coating

WiDE®-B coating eliminates the BARC open etch step in i-line lithography


Bake Temperature


182°C


190°C

WiDE®-B was developed as a wet developable i-line bottom anti-reflective coating that eliminates the need for a BARC etch step. The extended bake latitude and advanced optical characteristics of the WiDE® series allow use of a wet develop process in the sub half micron region. WiDE® anti-reflective coatings minimize CD variation by elimination of standing waves and reflective notching. This material can also be used for dry etch systems with excellent results. WiDE® has been successfully used as a sacrificial layer for lift-off applications.

Features:

  • Compatible with leading i-line resists
  • Sub 0.5µm wet patterning capable
  • High absorbance allows less than 0.01µm variations over 1800Å topography
  • Useful as a sacrificial layer in lift off applications
  • Wet developable – no impact on etch tool or cycle time
  • 10°C bake temperature range for 0.35µm geometry
  • Able to perform as a dry etch BARC as well.

All ARC® products are PFOS Free, for your health and the safety of the environment.