WiDE® Series Wet Develop i-Line Anti-Reflective Coating

WiDE®-Series coating eliminates the BARC open etch step in i-line lithography

WiDE®-Series coating is a wet developable i-line bottom anti-reflective coating that eliminates the need for a BARC etch step. The extended bake latitude and advanced optical characteristics of the WiDE® series of coatings allow use of a wet develop process in the sub-0.5 micron region. WiDE® anti-reflective coatings minimize critical dimension (CD) variation by elimination of standing waves and reflective notching. This material can also be used for dry etch systems with excellent results. WiDE® coatings have also been successfully used as a sacrificial layer for lift-off applications.

Benefits

  • Conserve photoresist etch budget and improve throughput by eliminating the BARC open etch step
  • Use as a sacrificial layer in lift-off applications
  • Use with leading i-line resists
  • Enhance CD control over topography with a high absorbance BARC

Wet-Developable Bake Latitude

The solubility of WiDE®-Series anti-reflective coating changes as the heat-driven reaction progresses. At low bake temperatures, the film is more soluble, and until the reaction is complete, small features exhibit isotropic etch and pattern loss from undercutting. Within the working range, resist features are retained while exposed photoresist and the BARC under it are removed by the wet-developable process. At temperatures above the bake latitude, the reaction causes loss of BARC solubility and incomplete BARC removal during the wet-develop step, which is illustrated below. The bake latitude range is dependent upon CD size. The larger the CD size, the wider this range.

WiDE®-Series temperature latitude

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