The use of adhesion promotion is required for the photoresist material to adhere to the substrate. The application of adhesion promoting materials begins with a dehydration bake. Then the wafer will be exposed to a vapor or materials, such as HMDS, in vacuum to coat the substrate. This is called vapor-priming.
The application of an ARCŪ layer on the substrate eliminates the need to deposit an HMDS layer. It can be argued that ARC material is more expensive than the vaporized material, but an ARC layer not only provides very effective adhesion, it also provides a complete solution package to all problems associated with reflective notching, topography planarization and standing waves.
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