BSI

Lift-off Layer

Lift-Off Applications

The ARC® layer performs its function as an anti-reflective coating for CD control and then is removed as a sacrificial layer that promotes lift-off. The use of WiDE, wet developable ARC product, has an added benefit in that lift-off applications in that the ARC layer allows lift-off and removal of the metal that is deposited on the photoresist. This process is applicable for the manufacturing of Surface Acoustic Wave (SAW) guides.

 

 

1. During the photoresist develop step, the wet develop ARC layer undercuts beneath the photoresist.

 

2. A metal layer is then deposited onto the photoresist.

 

 

3. Due to the ability of wet develop ARC to undercut beneath the photoresist, this enables the lift-off solvent to remove the metal coated photoresist easier. This results in leaving only the metal on the substrate.


Depending on your wavelength and photoresist compatibility, here are the suggested BARC products:

365nm

436nm

WiDE®

XLT-B

Would you like more information about thess products? Please click here to access our request form or call +573.364.0300 (U.S.A.) and request an ARC® products technical expert.


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