ARC® 162B 193-nm (ArF)
ARC® 162B coating improves wafer throughput and conserves etch budget for a wide range of 193-nm lithography layers
Benefits Include:
Benefits Include:
- Minimize the number of materials required by applying to both FEOL and BEOL layers
- Increase tool uptime due to ultralow outgassing
- Conserve etch budget with a fast, dry etching BARC
- Increase flexibility in photoresist selection
