ARC®160 - Avoid unscheduled maintenance of your coat/bake module by reducing out-gassing during BARC bake by making ARC®160 your fast-etch process of record.

ARC®93 combines the latest in technology to offer the ArF photolithographer a fast etching BARC with broad photoresist compatibility and low outgassing during bake.  This material is designed for gate, contact and via fill applications.

ARC®82A is a leading edge 193nm anti-reflective coating designed for improved depth of focus with advanced ArF photoresist. This 2nd minimum BARC is compatible with Fuji Film, JSR, Sumitomo, and TOK photoresist.

ARC®66 is Fuji Film, JSR and TOK photoresist compatible. Designed for use on hard-mask processes.

ARC®29A is a leading anti-reflective coating for 193nm photolithography. This 2nd minimum material is compatible with a broad range of ArF photoresist. It is available in formulations for 200 & 300mm process.

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Product	n	k	Cauchy A	Cauchy B	Cauchy C
ARC®160	1.79	0.30	1.47	0.0144	0.0
ARC®93	1.84	0.38	1.52	1.65E-02	6.90E-04
ARC®91	1.69	0.55	1.518	8.67E-03	0.00
ARC®82A	1.65	0.54	1.59	6.40E-03	0.00
ARC®66	1.82	0.25	1.55	9.0E-03	0.00
ARC®29A	1.82	0.34	1.52	5.10E-03	0.00

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Would you like more information about 193nm ARC® products? Click here to fill out an inquiry form or call 573.364.0300 (US) to talk directly to a technical representative.