Cee® 200CB Flange Mount Specifications

• Spin module: 14"L x 14"D x 16"H (35.56 cm x 35.56 cm x 40.64 cm)
• Bake module: 12.875"L x 12.875"D x 15.75"H (32.7 cm x 32.7 cm x  40 cm)
• Remote keypad, optional: 8.28"L x 7.5"D x 7.5"H (21 cm x 19 cm x 19 cm)
• Optional face mount stationary: <br>7.5"L x 7"D x 2.75"H (19 cm x 17.78 cm x 7 cm)
• Machine weight: 165 lb (75 kg)
• Ship weight: 250 lb (113 kg)
• Also available in standalone Cee® 200FL spinner or standalone Cee® 1300FL bake unit

• Alphanumeric-capable graphical user interface (GUI)
• User-friendly touch screen interface and display
• 700 process programs
• 20 steps per program (upgradable with software option)
• 0.1-second resolution for step times (0 to 999.9 sec/step)
• Spin speed: 0 to 6,000 rpm (12,000 rpm option at no charge)
• Spin speed acceleration
  • 0 to 30,000 rpm/sec unloaded
  • 0 to 23,000 rpm/sec for a 200 mm substrate
  • 0 to 3,000 rpm/sec for a 6" x 6" x .250" photomask recessed chuck
• Three automated bake methods (contact, vacuum and proximity)
• Bake plate auto-sizing for 3", 100 mm, 125 mm, 150 mm, 200 mm
• Temperature data recording standard
• PC compatible: Ethernet port for uploading/downloading process 
  parameters standard
• Simultaneous dual automated dispense capability
• Security: Password protection option at no charge

•  Spin speed repeatability: < 0.2 rpm
•  Spin speed resolution: < 0.2 rpm
•  Substrate sizes (< 1 cm to 200 mm round / 6" x 6" square)
•  Temperature resolution: 0.1°C
•  Temperature range: Ambient to 300°C (400°C optional)
•  Temperature uniformity: 0.3% across working surface

• Indirect drive system protects the spin motor from accidental contact with process chemicals and solvents
• Vacuum and lid interlock standard
• Industry-leading reliability and up-time
• 1-year full warranty for parts and labor
• Free technical phone support for the life of the product
• Application process assistance for life of the product

• Stainless steel construction
• ETFE-coated spin bowl option for material compatibility
• Optional polyethylene liners available
• Optional polyethylene/Teflon® splash ring
• Closed and optional open lid designs for process flexibility
• Drain and exhaust ports located in the bottom of the bowl
• Optional nitrogen purge for an inert spin environment
• Exhaust hood for removal of process chemicals
• Optional nitrogen purge for inert bake environment

The Brewer Science Cee^® 200 Spray and Puddle Developer is available as a benchtop coater (Cee^®200 Spin Coater) or as a combination coat-bake system (Cee^® 200 CB Coater-Bake Plate).

Brewer Science welcomes the opportunity to provide quality solutions for your specific application. Please contact us by email or call +573.364.0300 (US).  Our support staff will promptly respond to your request.